International Research Journal of Engineering and Technology (IRJET)
e-ISSN: 2395 -0056
Volume: 04 Issue: 04 | April-2017
p-ISSN: 2395-0072
www.irjet.net
Design and Modeling of Substrate Integrated Waveguide based Antenna to Study the Effect of Different Dielectric Materials Jagmeet Kour1, Gurpadam Singh1, Sandeep Arya2 1Department
of Electronics and Communication Engineering, Beant College of Engineering & Technology, Gurdaspur, Punjab-143521, India 2Department of Physics & Electronics, University of Jammu, Jammu, J&K-180002, India ---------------------------------------------------------------------***---------------------------------------------------------------------
Abstract - In this paper, antenna models of substrate
as the package that embeds the chip-set, but they genuinely represent a paramount portion of the system [2]. At low frequencies these components are typically fabricated in planar technology (microstrip or coplanar waveguides); at frequencies higher than 30 GHz, however, transmission losses and radiation avert the utilization of microstrip or coplanar waveguides and other technological solutions have to be identified. Thus the prosperous development of mmwave wireless systems requires the definition of a platform for implementing all these components with a high performance, low-cost and reliable technology. A potential candidate for developing such systems is substrate-integrated waveguide (SIW) technology [3–7]. SIWs are integrated waveguide-like structures fabricated by utilizing two rows of conducting cylinders or slots embedded in a dielectric substrate that electrically connect two parallel metal plates. The schematic is shown in Fig. 1. In this way, the non-planar rectangular waveguide can be made in planar form, compatible with subsisting planar processing techniques. SIW structures exhibit propagation characteristics kindred to the ones of classical rectangular waveguides, including the field pattern and the dispersion characteristics.
integrated waveguide (SIW) has been analyzed and designed to investigate the effect of dielectric materials on its operating parameters. Parameters that have been evaluated in this work are electric field, return losses, bandwidth and the transmission gain. Printed circuit board (PCB), Silicon (Si) and Mica are used as different dielectrics to evaluate the results in the frequency domain between 6 to 11 GHz. Design steps in an orderly manner were pursued for the optimization of geometrical dimensions followed by the finite-element method (FEM) based modeling of the SIW structure. The results obtained had shown that the transmission is possible for all the three cases but the optimized results were observed for Silicon as dielectric substrate. Key Words: Substrate Integrated Waveguide, insertion loss, cylindrical vias, microstrip line.
1. INTRODUCTION The amelioration in mm-wave technologies is consequential for the development of wireless systems as broadband and high resolution techniques are held up by the utilization of mm-waves. In the majority of these systems, the accomplishment of this technology largely depends on the accessibility of a cost-effectual technology, felicitous for the mass-engenderment of components and systems. It is prognosticable that high-density amalgamation techniques, cumulated with a low-cost manufacture process, be supposed to be able to present widespread solutions for mm-wave commercial applications. The nucleus of these systems is cognate to the active part, which includes components such as local oscillators, mixers and possibly low-noise amplifiers among others. Now-a-days, such components can be incorporated in the outward appearance of chip-sets at plausibly low cost. A number of semiconductor companies are at present running towards the enlargement of chip-sets working at 45 GHz or even at higher frequencies [1]. On the other hand, incipient components are desirable in mm-wave systems, which cannot be expediently incorporated in the chip-set, because either they are too astronomically immense or the required performance cannot be achieved by integrated components (such as antennas, selective filters and power amplifiers). These adscititious components could be simply considered
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Fig -1: Geometry of a SIW
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