• Semiconductor Packaging Capillary Market size was valued at US$ 298.5 million in 2024 and is projected to reach US$ 476.8 million by 2032, at a CAGR of 6.91% during the forecast period 2025-2032
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• The global Semiconductor Packaging Capillary Market size was valued at US$ 298.5 million in 2024 and is projected to reach US$ 476.8 million by 2032, at a CAGR of 6.91% during the forecast period 2025-2032. While the broader semiconductor industry was estimated at USD 579 billion in 2022, it’s expected to grow to USD 790 billion by 2029 at a 6% CAGR, creating significant demand for packaging components.
• Semiconductor packaging capillaries are precision components used in wire bonding processes for IC and LED packaging. These high-performance capillaries, made from materials like tungsten, titanium or ceramic, enable precise interconnection between semiconductor dies and substrates. The capillaries play a critical role in ensuring reliable electrical connections while maintaining thermal and mechanical stability during packaging operations.
By Types
• Tungsten Capillary
• Subtypes: Single bore, Multi-bore, and others
• Titanium Capillary
• Subtypes: Standard grade, High purity grade
• Ceramic Capillary
• Subtypes: Alumina, Zirconia, and others
By Applications
• IC Packaging
• Sub-applications: Flip chip, Wire bonding, and others
• LED Packaging
• Other
• Includes MEMS, power devices packaging
By
End-User:
• Semiconductor Manufacturers • OSAT Providers • Research Institutes • Other Electronics Manufacturers
By Capillary Diameter:
• Below 50 μm
• 50-100 μm
• 100-150 μm
• Above 150 μm
Key Players :
• Kulicke & Soffa (Singapore)
• Adamant Namiki Precision Jewel (Japan)
• TOTO (Japan)
• PECO (U.S.)
• SPT (South Korea)
• Suntech Advanced Ceramics (China)
• Mijiaoguang Technology (China)
• Delywin (China)
• CCTC (China)
• Kosma (Taiwan)
Email: help@semiconductorinsight.com
