Market size was valued at US$ 234.9 million in 2024 and is projected to reach US$ 456.2 million by 2032, at a CAGR of 9.9% during the forecast period 2025-2032
Report Studies
• The global DBA (Direct Bonded Aluminum) Substrate Market size was valued at US$ 234.9 million in 2024 and is projected to reach US$ 456.2 million by 2032, at a CAGR of 9.9% during the forecast period 2025-2032.
• DBA substrates are advanced ceramic-metal composite materials where aluminum is directly bonded to ceramic without intermediate layers. These substrates play a critical role in power electronics applications due to their excellent thermal conductivity, electrical insulation, and mechanical reliability. The technology combines ceramic’s insulating properties with aluminum’s heat dissipation capabilities, making it ideal for high-power semiconductor packaging.
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By Type:
• The market is segmented based on substrate thickness into:
• 0.32mm
• Others
• Subtypes: 0.25mm, 0.38mm, and others
• The market is segmented based on application into:
• New Energy Vehicles
• Electric Trains
• Industrial Machinery
• Others
• Mitsubishi Materials Corporation (Japan)
• DENKA Corporation (Japan)
• DOWA METALTECH Co., Ltd. (Japan)
• Littelfuse IXYS (U.S.)
• Ferrotec Corporation (Japan)
• Rogers Corporation (U.S.)
• KCC Corporation (South Korea)
