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Camera module & touch sensor assembly adhesives are specialized bonding materials used in electronic devices for precise and durable component attachment. These adhesives are engineered to provide strong adhesion while maintaining optical clarity, flexibility, and resistance to environmental factors such as heat and moisture.

Market growth is driven by the rising demand for advanced camera modules in smartphones, automotive systems, and IoT devices, coupled with increasing adoption of touch-enabled displays. Major players like Henkel, Dymax, and DELO dominate the market with innovative adhesive solutions tailored for miniaturized and high-performance electronic assemblies. USD 258 MILLION USD 380 MILLION
6.9%
BY TYPE
UV Curable Adhesives
Non-UV Curable Adhesives

BY APPLICATION
Camera Module Assembly
Touch Sensor Assembly

The global smartphone market, projected to units shipped annually by 2025, is driving un for camera module and touch sensor assem Modern smartphones incorporate an averag modules per device, with high-end models c This multi-camera trend, combined with the components, creates substantial opportunit adhesives that offer precision bonding, ther shock resistance.


The market presents significant opportunities for biobased adhesive development, with growing demand for sustainable solutions in consumer electronics. Recent advances in plant-derived polymers have produced adhesives with comparable performance to petroleum-based products at only 10-15% cost premium. Major brands are increasingly adopting these eco-friendly alternatives to meet corporate sustainability goals and appeal to environmentally conscious consumers. The segment is projected to grow at 18% CAGR through 2030 as material science continues to improve.
The increasing adoption of smartphones, tablets, and IoT devices with advanced camera and touch functionalities is propelling the demand for highperformance adhesives in module assembly. As device manufacturers pursue thinner designs without compromising durability, UV-curable adhesives have gained significant traction, accounting for over 35% of the global market share. These adhesives offer rapid curing times and superior bonding strength, making them ideal for delicate components in compact devices. Market data indicates the segment will grow at a 7.2% CAGR through 2032, outpacing conventional nonUV alternatives.
The North American market for camera module and touch sensor assembly adhesives is characterized by high technological adoption and stringent quality standards, driven by the presence of major smartphone manufacturers and automotive electronics suppliers. The U.S., being a key manufacturing hub for consumer electronics, accounts for the majority of demand. Increasing focus on miniaturization and durability in electronics has led to higher adoption of UV-curable adhesives, particularly in high-resolution camera modules. However, supply chain disruptions and fluctuating raw material costs have recently pressured manufacturers to explore local sourcing alternatives.
Europe's market growth is strongly influenced by automotive and industrial electronics demand, particularly in Germany and France. EU regulations on chemical safety (REACH) have accelerated the shift toward eco-friendly adhesives, including bio-based formulations. The region also sees increasing R&D investments in adhesives for advanced driver-assistance systems (ADAS), where thermal stability is critical. However, high production costs and dependence on Asian supply chains remain challenges.


Dymax Corporation (U.S.)
DELO Industrial Adhesives (Germany)
Henkel AG & Co. KGaA (Germany)
H.B. Fuller Company (U.S.)
NAMICS Corporation (Japan)
Addison Clear Wave (U.S.)
ThreeBond Holdings (Japan)
Ajinomoto Fine-Techno Co., Inc. (Japan)

These companies represent some of the major key players driving innovation and growth in the market, contributing significantly to global supply and competitive dynamics.

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