LANGUAGE
English / Fluent (TOEIC 850)
Mandarin / Native Taiwanese / Fluent
MANAGEMENT
Smartsheet
Google Sheet
DESIGN
Adobe Photoshop
Adobe Illustrator
Adobe InDesign
Rhino7 / 8
Creo
AutoCAD
TOPS
OTHER EXPERTISE
Intellectual Property Law
Design Patent
Emma Yen (顏岑芳) +886 963-227641
tsenfangyen@gmail.com
10+ years of experience as a Packaging Engineer. Familiar with packaging material and production process. Experienced in overseas and cross function coordination. Good at supplier training and budget controlling. Very good team player. Calm face but humorous soul.
2023 – Now NZXT Inc. / Senior Package Engineer
*PC gaming products: case, cooler, power supply, motherboard and gaming peripherals.
*Program management:
- Conducted a packaging & shipping cost evaluation tool development.
- Led shipping information data transfer process enhancement.
- Built up packaging material declaration data base.
- Conducted trial run labeling rules and packaging sample arrangement.
- Led expanded plastic material removal for all AU skus.
*Packaging standardization:
- Published packaging general requirements document for design language, testing standards and recycling labels.
2021 – 2023 HP Inc. / HyperX Package Engineer
*Supplier training for new system & new rule implementation (following HyperX and HP merger):
- Released new guidelines and held online briefing.
- Coordinated artwork review process to support a large volume of compliance change.
*Sustainable packaging:
- Developed paper sealing solutions: paper stickers and paper zipper design.
- Design change to replace blister with paper solution.
2017 – 2021 Kingston Technology / HyperX Package Engineer
*Gaming headset, TWS earbuds, keyboard, mouse and charger packaging.
*From ideation to implementation:
- Unboxing experience review and cost reduction evaluation.
- Generated from concept to Packaging PRD.
- Released initial die-line and work with Creative team for artwork layout.
*Packaging process optimization:
- Consolidated trial run packaging requirement to speed up testing process.
- Unified packaging dimension to decrease artwork design loading and speed up shipping planning.
- Printing color management: standardized press-proof material and establish color limit samples.
- Studied the limitation of online printing and unify label spec.
*Set up packaging prototyping lab.
2014 – 2017 Compal Electronics Inc. / Package Design Engineer
*Smart phones, tablets and IoT products packaging.
*Acting as a bridge between the brand owner, the manufacturer and the factory:
- Translated packaging concepts into engineering language and material spec.
- Created BOMs and manage engineering change.
- Provided packaging instruction document to the production line.
- Packaging assembly automation process to decrease cost.
Education / Master degree at College of Intellectual Property of NTUST
Major Research / Design Patent Infringement
Bachelor’s degree Department of Industrial Design of NTUST
Major / Industrial Design
Sub major / Technology Management