International Research Journal of Engineering and Technology (IRJET)
e-ISSN: 2395-0056
Volume: 11 Issue: 02 | Feb 2024
p-ISSN: 2395-0072
www.irjet.net
ENHANCEMENT OF HEAT TRANSFER FOR ELECTRONIC DEVICES USING HEAT PIPES WITH NANO FLUIDS Nallathambi. S1, Dr.P.Sabarinath2, Ganeshbabu E V3, Samynathan T4 1,3,4Assitant Professor, 2Associate Professor, Dept. of Mechanical Engineering, KLN College of Engineering,
Pottapalayam, Tamil Nadu, India ---------------------------------------------------------------------***--------------------------------------------------------------------
Abstract: Heat pipes are one of the most effective
procedures to transport thermal energy from one point to another, mostly used for cooling on a combination of conduction and convective heat transfer. A typical heat pipe consists of an evaporator attached to the heat source and the opposite end (a condenser) attached to the heat sink. The middle section (the adiabatic section) is insulated. In this paper, the design, fabrication and testing of heat pipe for transferring a heat load of 31.3 W is discussed. In this heat pipe, it consists of silver oxide as nano-fluids and mild steel wire mesh with cotton for making wick. Nano-fluids are prepared by the electrochemical synthesis method by selecting the appropriate temperature, voltage, and current. The overall length of the heat pipe is 100 mm, and the temperature difference in the heat pipe is 30⁰C. The temperature difference in each section, i.e., the evaporator, adiabatic, and condenser sections of the heat pipe, are shown in the graph, and the results are discussed.
Fig -1: 2D view of wick type heat pipe
Key Words: Nano fluid, Heat pipe, adiabatic, nano particles, Electrochemical, Silver Oxide.
1. INTRODUCTION The demand for faster and smaller micro-electronic systems continues to increase, and consequently, the amount of heat produced per volume increases. Therefore, the need for novel, efficient cooling devices is vast. Heat pipes are effective passive heat spreaders that can be used to solve this problem. Due to the combined convection and phase transition, high heat exchange efficiency can be achieved. Heat pipes are promising devices to remove thermal energy and keep the integrated circuits at the proper working temperature. The advantage of the heat pipe is that it uses phase change phenomena to remove thermal energy since the heat transfer coefficient of the phase change is normally 10 to 1000 times larger than typical heat transfer methods such as heat conduction, forced vapor or liquid convection. Other applications of electronic cooling have included rectifiers, thyristors, transistors, traveling wave collectors, audio and RF amplifiers, and high density-semiconductor packages.
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Fig -2: Image of wick type heat pipe with thermo couple and aluminium fin fitted in evaporator section 2. Literature Review A.Naveen (2018) et al studied a TiO2 nano fluid heat pipe designed for diameter and length of 31 mm and 500 mm respectively. It was tested by a container. The heat pipe was made of wick, copper, and stainless steel. The maximum heat load was 100W and the temperature was 373K in the maximum range. Swati Verma (2017) et al ISO 9001:2008 Certified Journal
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