International Research Journal of Engineering and Technology (IRJET)
e-ISSN: 2395-0056
Volume: 10 Issue: 08 | Aug 2023
p-ISSN: 2395-0072
www.irjet.net
HEAT TRANSFER ANALYSIS ON LAPTOP COOLING SYSTEM BEFORE AND AFTER INTRODUCING A COOLER AT EXHAUST Prathamesh Kulkarni1, Faizan Sutar2, Pranav Khade3, Pratikraj Kakade4 1,2,3,4 Students, Department of Mechanical Engineering, Kolhapur Institute of Technology’s College of Engineering,
Kolhapur, Maharashtra, India. ---------------------------------------------------------------------***--------------------------------------------------------------------1.1 Relevance Abstract - This project uses CATIA and SolidWorks tools to do a thermal analysis and cooling system optimisation of a laptop microprocessor. The aim of the study is to evaluate the ability of the heat pipe, heat sink, and VGA fan to dissipate heat under various operating conditions. The laptop's complex solid model was created using the CATIA software, whereas the SolidWorks software was put to use for the thermal analysis. The results show that the cooling system can effectively dissipate heat produced by the microprocessor, and that the thermal performance is affected by elements like airflow rate and thermal conductivity of the materials used in the heat sink. After the result of these studies, a new cooler is developed and fitted to the previous system in order to further improve thermal efficiency, or the capacity to dissipate heat. This minute change has a significant impact on the laptop's ability to dissipate heat. This research will be helpful in the design and development of new cooling systems for electronic devices which are similar to laptops.
Since it addresses the crucial problem of thermal management in laptops, the thermal analysis of a laptop cooling system is a very relevant and important task. Laptops frequently struggle to adequately dissipate heat because of the growing need for high-performing computing and thin designs. Through research and performance optimisation, the cooling system's efficiency will be improved, resulting in better thermal control and overall laptop reliability. This project will help to our understanding of laptop thermal behaviour by doing a thermal analysis under various operating conditions and workload situations. It will involve analysing heat dissipation systems including VGA fans, heat sinks, and heat pipes and exploring potential design modifications or improvements. The project's findings can be used to design laptop cooling systems that are more effective and reliable, improving user experience, extending hardware lifespan, and minimising the possibility of thermal failures.
Key Words: Cooling, Cooling System, Thermal Analysis, Simulation, Heat Dissipation.
The primary objectives of this project is to improve user experience, reliability, energy efficiency, and environmental impact while also enhancing laptop performance. The project aims to resolve these problems and contribute to the development of more effective, reliable, and environmentally friendly laptop cooling systems by addressing thermal management concerns.
1. INTRODUCTION Overheating is a major problem with laptop operation because it can negatively impact stability and performance, possibly resulting in hardware failure and system crashes. The aim of this research was to examine the thermal behaviour of a laptop computer and evaluate how well the suggested cooling technique succeeded in preventing overheating issues. In this project, we thermally analysed the HP Pavilion i5 11 Generation laptop. where we concentrated on researching the cooling system's capacity to dissipate heat under diverse operating conditions. To accomplish this, we created a solid model of the laptop using CATIA software, and then conducted the thermal analysis using SolidWork software. Although the i5 11 Generation Intel Core processor is extremely efficient, it produces a lot of heat. In order to avoid thermal throttling, which may decrease efficiency and affect the processor, this heat must be adequately drained. Therefore, an effective cooling system should be built in place to maximise thermal efficiency. To reduce the heat that the CPU produces Heat pipe, heat sink, and VGA fan were already included in the model, but we added a new cooler to the design to maximise heat dissipation.
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2. LITERATURE SURVEY In paper titled “CFD Thermal Analysis on Laptop Cooling System Using Loop Heat Pipe Technology”, Mr. Ravikiran Chinthalapudi shows that Science and technology have begun a new era in the history of humanity. As a result of technology progress, electronic devices have become smaller, lighter and faster, especially laptops. Laptops are subjected to a lot of heat for high process units, which cause high spots on the processing unit. Because the current cooling system is weak for heat dissipation in warm locations, the trendy MLHP heat pipe technology is upgraded for better cooling. Compared with current active cooling technologies, this novel passive cooling solution also provides various benefits such noisefree operation, lower energy usage and increased reliability. This article offers a visual depiction of a new laptop cooling solution and evaluates Fluent's approach for the victimization of fluid dynamics. This test has varying thermal reductions,
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