International Research Journal of Engineering and Technology (IRJET)
e-ISSN: 2395-0056
Volume: 10 Issue: 05 | May 2023
p-ISSN: 2395-0072
www.irjet.net
Thermal Characterization and Performance Evaluation of CPU Heat Sink Design Ninad Joshi1, Abhishek Kadam1, Himanshu Jaiswal1, Jitesh Mathkar1, Dattatray Hulwan1, Sunil Shinde1 1Mechanical Department, Vishwakarma Institute of Technology, Pune-411037
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Abstract - This research paper presents a thermal
generated by the processor. In this paper, we will analyse the thermal performance of the heat sink using ANSYS Discovery software. This software is capable of accurately simulating the thermal behaviour of complex systems, making it an ideal tool for studying the thermal behaviour of the heat sink. We will also investigate the effect of different parameters such as the airflow rate and thermal conductivity of the materials used in the heat sink on its performance. The results of this study will provide valuable insights into the thermal behaviour of the heatsink of the Intel Core Third-generation processor. This knowledge can be used to optimise the design of the heat sink and improve the thermal performance of the processor. The heat generated by the Central Processing Unit (CPU) of a computer is a major concern in modern computing. CPUs can generate a significant amount of heat due to the high processing power required for modern applications. If the heat generated by the CPU is not dissipated efficiently, it can lead to thermal throttling and decreased performance, and even permanent damage to the CPU. To prevent these issues, heat sinks are commonly used to cool down the CPU. Heat sinks are designed to increase the surface area of the CPU and dissipate heat efficiently. They work by transferring the heat generated by the CPU to the surrounding air through conduction and convection. The increased surface area provided by the heat sink allows for more efficient heat transfer, which helps to keep the temperature of the CPU at a safe level. Heat sinks are typically made of materials with high thermal conductivity, such as aluminium or copper, to enhance their heat dissipation capabilities. They may also be combined with fans or other cooling devices to increase the rate of heat dissipation. The thermal performance of a heat sink can be analysed through various techniques, including computational fluid dynamics (CFD) and finite element analysis (FEA). These tools allow designers to optimise the design of heat sinks to maximise their thermal performance and ensure that the CPU stays within safe operating temperatures. In summary, heat sinks are a critical component for maintaining the thermal performance and reliability of CPUs. They play an essential role in transferring the heat generated by the CPU to the surrounding environment and preventing thermal
analysis of a heat sink for a microprocessor using SolidWorks and ANSYS Discovery software. The aim of the study is to analyse the heat dissipation capacity of the heat sink under different operating conditions. The simulation model of the heat sink is developed using SolidWorks, and the thermal analysis is performed using ANSYS Discovery software. The results show that the heat sink is capable of efficiently dissipating heat generated by the microprocessor, and the thermal performance is influenced by factors such as the airflow rate and the thermal conductivity of the materials used in the heat sink. The findings of this study can be useful in the design and optimization of heat sinks for microprocessors to enhance their thermal performance and reliability. Key Words: ANSYS Discovery, SolidWorks, Thermal analysis, Fins, Forced Convection, Heat Flux, CMM (Coordinate Measuring Machine)
1. INTRODUCTION While Thermal analysis is a crucial aspect of modern electronic device design, especially in high-performance microprocessors such as the Intel Core third generation. The increasing demand for faster and more powerful computing has resulted in a significant increase in the heat generated by these devices. To ensure optimal performance and prevent damage, it is essential to accurately model and analyse the thermal behaviour of these devices. In this research paper, we aim to perform a thermal analysis of the heat sink of the Intel Core third generation microprocessor. We will focus on studying the heat dissipation capacity of the heat sink under various operating conditions. To achieve this goal, we will use SolidWorks to develop a simulation model of the heat sink and ANSYS Discovery software to perform the thermal analysis. The third-generation Intel Core processor is a highly efficient processor, but it generates a significant amount of heat. This heat needs to be dissipated efficiently to prevent thermal throttling, which can lead to a decrease in performance and damage to the processor. The heat sink is a critical component that helps to remove the heat
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