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Maxim Unveils Smallest, Most Power-Efficient Dual IO-Link Transceiver with DC-DC Regulator and Surge Protection
Win a LAN7430 PCIe 3.1 Ethernet Bridge Evaluation Board
Designers can now enable smarter digital factories with the MAX22513 surge-protected, dual-driver IO-Link® device transceiver with integrated DC-DC buck regulator from Maxim Integrated Products, Inc. As the industry’s smallest, most powerefficient and robust IO-Link device transceiver, it is ideal for industrial IO-Link sensors and actuator devices.
As Industry 4.0 systems become smarter, sensor and actuator devices must continue to become smaller and more robust while dissipating less power to easily adapt to their manufacturing environments. In addition, integrating multiple discrete solutions into a design makes it difficult for designers to create robust working solutions while meeting time-to-market demands. The MAX22513 continues Maxim’s leadership in enabling adaptive manufacturing for Industry 4.0 applications. By integrating the DC-DC regulator and surge protection while providing 4x lower power dissipation and 3x smaller size versus the closest competitor, Maxim continues to enable the trend towards shrinking IO-Link designs that need robust communications with faster time to market. In addition, integrated surge protection and reverse polarity ensure robust communications in harsh industrial environments to speed up the design process. The IC operates over the -40°C to +125°C temperature range and is available in both a 28-pin QFN package (3.5mm × 5.5mm) and a WLP (4.1mm × 2.1mm). Key Advantages • Small Size: Highly integrated IC simplifies design process and shrinks solution size by 3x compared to closest competitor; Integrated surge protection eliminates four TVS diodes compared to Maxim’s previous solution • Low Power: 4x lower power dissipation is enabled by low 2Ω (typical) on-resistance drivers as well as a 300mA (maximum load) DC-DC regulator with 80 percent efficiency • Robust Communications: All four IO pins are reverse-voltage protected, short-circuit protected and feature ±1kV/500Ω surge protection Maxim Integrated | www.maximintegrated.com www.international.electronica-azi.ro
Win a LAN7430 PCIe 3.1 Ethernet Bridge Evaluation Board (EVB-LAN7430) from Electronica Azi International. Microchip's LAN7430 is a PCIe 3.1 (at 2.5GT/s) to Gigabit Ethernet bridge, providing an ultra-high-performance and cost-effective PCIe to Ethernet connectivity solution for embedded and automotive applications. LAN7430 contains an integrated Ethernet PHY, PCIe PHY, PCIe endpoint controller, Ethernet MAC, Integrated OTP, JTAG TAP and EEPROM controller. The device supports 10BASE-T, 100 BASE-TX and 1000BASE-T Ethernet with auto-negotiation, auto-polarity correction, HP Auto-MDIX† support and is compliant with IEEE 802.3/802.3u/802.3ab standards. PCIe-based networking provides flexibility for the routing and placement of network connections anywhere in the system. Specific enhancements for PCIe LPSS (Low Power Sub-States) L1.1 and LPSS L1.2 have been integrated to lower system power consumption. LAN7430 is available with a wide range of drivers including Windows®, Linux®, and Pseudo Code for development towards RTOS. LAN7430 also supports Precision Time Protocol using industry standard 1588-2008 PTP. GPIOs are provided that can be software defined for this function. Included within this feature is a programmable timer compare output that can also be software configured. The LAN7430 integrates all needed voltage regulators and requires only a single 3.3V supply. Further BOM savings can be realized through the integrated clock tree only requiring one external crystal or clock source. An EEPROM interface is provided although is not mandatory - an integrated OTP memory can provide for configuration data, further reducing system design cost and burden. The LAN7430 is backed by Microchip’s free LANCheck® online design review service that reviews customer designs, ensuring that best design practices are used.
For your chance to win a LAN7430 PCIe 3.1 Ethernet Bridge Evaluation Board, visit: http://page.microchip.com/Elec-Azi-Int-LAN7430.html and enter your details in the online entry form. 3
Electronica Azi International » TABLE OF CONTENTS
3 | CONTEST: Win a LAN7430 PCIe 3.1 Ethernet
22 | High performance switches for e-cigarette and
Bridge Evaluation Board
vaping applications
6 | ADAS Technology Paves the Road to
24 | Considering Home Wireless Connected Lighting?
Fully Autonomous Vehicles 8 | Use Off-the-Shelf ICs to Simplify Power Management in Multiport PoE+ Systems
12 | Cover story
24
28 | Sensors for mobile machinery 29 | CONTRINEX: Magnetically or RFID-coded safety sensors
Surge-Proof Your Industrial Sensor Industrial sensors continue to get smaller and smarter while the environments in which they operate continue to grow bigger and more demanding. With thousands of pieces of equipment operating in close proximity to one another, their power supplies quickly become cross-contaminated. 15 | LED boost driver for low start-up voltage use 18 | Safe power in magnetic resonance imaging
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environment 30 | FUJIFILM PRESCALE: Pressure measurement film 31 | Leuze electronic nominated for the “Best of Industry Award 2019” 32 | SAKI Corporation Introduces Ultra-fast, Inline, 2D Bottom-side automated Optical Inspection for PCBs 34 | Martin offers an innovative solution to gently extract residual solder 18
35 | New competitive prices from PCB Electra & EMS Electra
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Electronica Azi International is published 6 times per year in 2019 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Copyright 2019 by Euro Standard Press 2000 s.r.l. All rights reserved.
Electronica Azi International | 2/2019
INSIGHT » ADAS TECHNOLOGY
ADAS Technology Paves the Road to Fully Autonomous Vehicles By Mark Patrick Mouser Electronics
It is estimated that over 80% of all road accidents are due to the driver being distracted in some way. The growing use of mobile phones worldwide, especially texting or taking a call while driving, has significantly increased the risk of accidents. In the United States alone, the Department of Transportation reported that mobile phones are involved in 1.6 million motor vehicle crashes each year, causing half a million injuries and 6,000 deaths annually. How can we, as design engineers, help make our vehicles and roads safer? Is the answer enforcing better driver training standards? Laws banning talking or texting while driving clearly don’t seem to be enough to deter people.
In a report published back in 2015, the World Health Organization (WHO) stated that over 1.2 million people die on the world’s roads each year, while 20 million to 50 million sustain non-fatal injuries. It also predicted that road traffic injuries will become the fifth largest cause of death globally by the time we reach 2030. While there has been progress toward improving road safety over the past 8 years, the WHO and other important bodies believe that the pace of change is too slow. Are humans just too stubborn that we have to make our vehicles smarter instead? The ongoing development of advanced driver assistance system (ADAS) technology is seen as one of the primary solutions for making our roads safer. With improvements introduced in the supporting sensor mechanisms and reductions being witnessed in the associated deployment costs, ADAS has been able to proliferate beyond luxury cars into medium and even lower end vehicles. According to Global Market Insights, the ADAS market is estimated to grow from USD 28.9 billion in 2017 to USD 67 billion by 2024 - more than doubling in a period of just 7 years. The firm also noted that stringent government regulations pertaining
to vehicle safety, including the mandatory fitting of safety technologies (like autonomous emergency braking and parking sensors), will further spur ADAS growth. GIVING ADAS A 360° VIEW OF THE ROAD ADAS is able to make use of combinations of different sensor technologies - infra-red (IR), ultrasonic, radar, image sensors, LiDAR and suchlike - in order to automate dynamic driving tasks, such as steering, braking and acceleration. In a market trends study published last summer, Gartner forecast that automotive image sensors will represent USD 1.8 billion worth of annual business by 2022 and this will be driven, if you pardon the pun, predominantly by ADAS.
Figure 1: Melexis ToF Imaging Chipset 6
Electronica Azi International | 2/2019
INSIGHT » AUTONOMOUS VEHICLES
The development of better cameras was key to bringing the cost of ADAS down and thereby making it more affordable for the mass market. As the main sensor resource for ADAS today, cameras are widely used in front-facing or outward-facing applications, as well as becoming increasingly common in driver-facing systems. Front-/outward-facing cameras can perform numerous functions. The most notable of these are lane departure alerts, vehicle proximity monitoring, traffic sign recognition, park assist, rear-view mirror replacement, blind spot detection and obstacle/pedestrian recognition. Conversely, driver-facing implementations focus on ensuring that the driver is able to make critical decisions (or if instead the ADAS will need to apply the brakes, carry out an evasive manoeuvre, etc.). Here monitoring for fatigue (blink sensing) and distraction (direction that the driver’s head is facing) are the key tasks. To improve the reliability of ADAS technologies, electronic component manufacturers such as ON Semiconductor are developing image sensors that perform well in very bright or low light conditions. The AR0230AT is a 1/2.7” format CMOS device with a 1928x1088 active-pixel array that captures images in either linear or high dynamic range (HDR) modes with a rolling-shutter readout. It supports both video and single frame operation, and includes camera functions such as in-pixel binning and windowing. Designed for both low light and HDR scene performance, this energy-efficient image sensor is programmable through a simple two wire serial interface. Aimed at driver-facing implementations, Melexis’ MLX75x23 arrays provide a complete time-of-flight (ToF) 3D imaging solution. They feature 320x240 QVGA resolution ToF pixels based on DepthSense pixel technology and exhibit strong sunlight robustness. The associated AEC-Q100qualified MLX75123 companion chip controls the ToF sensor and the illumination unit, as well as streaming data to the host processor. These chipsets offer performance, flexibility, and design simplicity in a very compact 3D camera. TEACHING CARS TO SEE BETTER THAN HUMANS Sensors detecting objects around the vehicle need to work together with object identification/classification technologies. Generally these consist of processors powered by machine or deep learning that enable the vehicle’s ADAS to effectively recognize movement, patterns, people, other vehicles, www.international.electronica-azi.ro
street signs and potential obstacles. One example is NXP Semiconductors’ S32V234 vision and sensor fusion processor IC, which is designed to support computation-intensive image processing applications. It incorporates an embedded image sensor processor, a powerful 3D graphic processing unit, dual APEX-2 vision accelerators, plus integrated security. Part of the NXP SafeAssure program, this device is suitable for ISO 26262 ASIL B functional safety compliant ADAS applications, such as pedestrian detection, lane departure warning, smart head beam control and traffic sign recognition. The processor integrates four 64-bit ARM Cortex-A53 cores running at up to 1GHz with a NEON co-processor and an ARM Cortex-M4 CPU. The Cortex-M4 allows automotive operating systems to interface with external devices separate from the CPU. Similarly, the TDA3x SoC series from Texas Instruments comprises highly optimized and scalable devices designed to meet ADAS requirements. These SoCs possess an optimal mix of low power operation, elevated performance (with up to 745MHz signal processing throughput), smaller form factors and ADAS vision analytics processing that strives towards greater vehicle autonomous. Supporting Full-HD video (1920×1080 resolution at 60fps), they enable sophisticated embedded vision functions like surround view, front camera, rear camera, radar and sensor fusion on a single scalable architecture.
Figure 2: S32Rx Radar MCUs from NXP AUTOMOTIVE RADAR Smarter microcontroller units (MCUs) that power long range, high resolution radar will be key to developing the next generation of safety-critical systems. NXP’s S32Rx radar MCUs are 32-bit devices that meet the high performance computation demands required by modern beam-forming fast chirp modulation radar systems, featuring radar I/F and processing, plus dual e200z cores and capacious system memory. Available in AEC-Q100 grade 1 and 257 MAPBGA packages, they are designed for applications like adaptive cruise control, autonomous emergency braking and rear traffic crossing alert.
DESIGNING A FUTURE FOR FULLY AUTONOMOUS VEHICLES Although there is a lot of hype about selfdriving cars currently, it must be remembered that we are still in the early stages of this technology. The Society of Automotive Engineers (SAE) has defined five levels of automation - with level 0 meaning no automation whatsoever and level 5 being fully autonomous. Today’s state-of-the-art vehicles when it comes to having a degree of autonomy (using Tesla’s Autopilot feature, for example) are still only at SAE level 2. Although there have been significant advances for image sensing and object recognition technologies over the past decade, we are a long way from fully autonomous vehicles yet. It is estimated that it will be at least another 15 years before SAE level 5 is implemented into the average car. However, the ambitious timelines of OEMs for achieving high degrees of automated driving are speeding up deployment of the ADAS components that underpin this technology. Volkswagen, Mobileye and Champion Motors recently announced a joint venture to deploy a fully driverless ride-hailing vehicle service in Israel - with limited rollout scheduled for 2019, followed by full-scale operation in 2022. Volkswagen will provide an electric vehicle platform into which Mobileye will integrate turnkey software and hardware technologies to enable automation, while Champion Motors will handle fleet management and maintenance aspects. ABI Research forecasts that in 2025, the automotive industry will ship 8 million consumer vehicles that feature SAE level 3 and 4 technologies - where drivers will still be necessary, but are able to completely shift safety-critical functions to the vehicle under certain conditions. The speed at which fully autonomous vehicles will enter the mainstream market will depend on whether society feels safe in cars where nobody is at the wheel. Complex legal concerns also need to be resolved about who (or what) would be held accountable when an accident happens where an autonomous vehicle is involved. The road ahead is one with plenty of uncertainties, but it is clear the days of human control being an integral part of the driving experience will soon be behind us. Mouser Electronics Authorised Distributor www.mouser.com 7
DESIGN SOLUTIONS » POWER MANAGEMENT
Use Off-the-Shelf ICs to Simplify Power Management in Multiport PoE+ Systems By: Rich Miron Contributed By Digi-Key's North American Editors A key advantage of Power over Ethernet (PoE) is its simplicity. However, the introduction of the “at” amendment to the (PoE+) to the IEEE 802.3 Ethernet standard increased the power available to powered devices (PDs) to 30 Watts (W) compared with the 15W of the original specification. For systems employing many ports, the higher capacity of PoE+ requires a large power supply to cope with demand.
Moreover, systems typically include multiple power supplies for redundancy, potentially undermining PoE’s simplicity. In a typical multiport PoE+ implementation, not all PDs will require maximum power, allowing the use of a smaller power supply. Still, the design challenge of managing different power levels from several supplies in systems that may comprise dozens of PDs remains daunting.
The solution is to base the power systems on specialized power management chips. Such chips manage power (via port controllers) to multiple PDs (with varying power requirements) from primary and backup supplies. This article describes the basics of PoE and PoE+ before introducing single-chip power management and port controller solutions, and showing how they can ease the design of multiport PoE+ systems. The basics of PoE and PoE+ The simplicity of PoE comes about through the combining of power and communications over a single CAT 5 cable. Using this feature, engineers can design and construct low maintenance networks quickly and inexpensively, compared to installations using separate power and data networks. PoE gained momentum at the turn of the century when voice over Internet protocol phones (VoIP) started taking advantage of proprietary Ethernet-based technologies that allowed both data and power to be carried over the same network.
Figure 1: Midspan PoE installations are popular when upgrading an existing Ethernet system to PoE because installed cabling can be retained, and costs reduced. (Image source: Microsemi Corp.) 8
The IEEE standardized the concept by adopting a PoE specification as an amendment (“af”) to the existing IEEE 802.3 Ethernet standard in June 2003. In 2009, a second amendment, “at”, was adopted enabling PoE to safely handle higher power. IEEE 802.3af can provide up to 15.4 watts Electronica Azi International | 2/2019
INSIGHT » PoE
and 44 to 57 volts DC (with a guaranteed 12.95 watts at the point of connection) to each PD on the network. Depending on the power requirement, PDs are defined as either Class 1, 2 or 3. The technology uses a single, standard RJ45 connector and CAT 5 (or CAT 3 if power requirements are modest) cable. “Alternative B” of the standard transfers power on the two pairs of wires (of the four
could be added to the standard as early as this year (2018). 4-Pair PoE introduces Classes 5, 6, 7 and 8, and accommodates up to 90 watts (71 watts at the PD) and 960 mA. Elements of a PoE system IEEE 802.3af defines two types of PoE device: PDs and Power Sourcing Equipment (PSE). A PSE draws power from a conventional power supply and then manages the
Figure 2a: PoE/PoE+ Alternative B calls for power to be delivered over spare (non-signal) pairs in the CAT 5 Ethernet cable. Midspan PoE implementations can only use this configuration. (Image source: Silicon Labs) pairs in CAT 5 cabling) not used to transfer Ethernet data. “Alternative A” applies a common-mode voltage on the data conductors of the cable to power connected devices. Because Ethernet uses differential signaling to carry data, the applied voltage does not compromise function. IEEE 802.3at can supply up to 30 watts (25.5 watts at the PD) and 50 to 57 volts DC to (Class 4) PDs. The PoE+ maximum current is 600 milliamps (mA) compared to the earlier technology’s 350 mA. PoE+ uses CAT 5 cable only, decreasing impedance and power losses. The IEEE 802.3at amendment is backward compatible with IEEE 802.3af, and the latest IEEE802.3-2012 standard incorporates the 802.3at specification. In addition to the power classes, PoE components are divided into two types: • Type 1 which is compatible with the IEEE 802.3af specification. • Type 2 which is compatible with both the IEEE 802.3af and 802.3at specifications. The latest version of the standard prohibits carrying power over all four pairs of twisted wires in a CAT 5 cable. However, proposals for so-called 4-Pair PoE are advanced and www.international.electronica-azi.ro
are employed for PoE+ network upgrades when the existing Ethernet switches are retained to lower cost and ease installation (Figure 1). An example of a midspan injector is Microsemi Corporation’s PD 9001 which is compliant with IEEE 802.3at. There is a further important distinction between endpoint and midspan implementations; the specification only allows midspans to be used in Alternative B
Figure 2b: PoE/PoE+ Alternative A calls for power to be delivered over signal pairs in the CAT 5 Ethernet cable. Endpoint PoE implementations can use both Alternative A and B configurations. (Image source: Silicon Labs)
power distributed over the Ethernet network. In turn, the PD is supplied via an RJ45 connector - eliminating the need for a builtin power supply. PoE is able to power PDs over typical Ethernet cable runs of up to tens of meters (m). The PoE standards provide for signaling between the PSE and PD. This signaling allows conforming devices to be detected by the PSE, avoiding potential damage to non-PoE devices attached to a network. A DC voltage of between 2.8 and 10 volts is applied across the conductor, and attached PDs present a resistive load of between 19 and 27 kiloohms (kΩ) using a parallel capacitor of 120 nanoFarads (nF) or less as a “signature”. Once detected, the PSE negotiates with the PD to determine the amount of power required. PSEs are supplied as either endpoints or midspans. Endpoints (or PoE switches) are Ethernet switches that incorporate PoE/PoE+ transmission circuitry. Midspans are PoE power ‘injectors’ sited between regular Ethernet switches and PDs, designed to add power without affecting the existing network’s signal integrity. Endpoints are normally used on new installations or when older networks are being completely upgraded to PoE+. Midspans
implementations (i.e. when power is delivered over the non-data carrying pairs in the cable) (Figure 2). Early PSEs incorporated discrete circuitry divided into the communication interface between the power supply and Ethernet network. To simplify PoE system design, vendors then introduced integrated PSE controllers that combine the PoE+ interface circuitry with the power supply. More recently, system design has been further simplified by increasing the capability of PSE controllers such that they integrate a microcontroller to enable local supervision of multiple ports. Practical PoE power management IC solutions An example of a single-chip solution is Silicon Labs’ Si3459 PoE PSE port controller. The chip is designed for use in PSE endpoints and integrates eight independent ports, each with PD detection and classification functionality. In addition, the Si3459 enables PD disconnect using a DC sense algorithm, software configurable per-port current and voltage monitoring, and programmable current limits. While the chip integrates an 8051 microcontroller, a host processor is required for full control. 9
DESIGN SOLUTIONS » POWER MANAGEMENT
This processor communicates with the Si3459 via a three-wire, I2C-compatible serial interface. By using the Si3459 in a PoE system, the designer can dramatically reduce the component count and complexity of the design.
Configuring multiport PoE installations The adoption of POE+ enhanced the practicality of the technology because its higher power delivery allowed a developer to connect power hungry devices such as security cameras with pan, tilt, and zoom
Figure 3: In this Type 1 configuration, the 20Ω cable resistance results in a power loss of 2.45 watts over the cable run. As a result, power delivered to the PD is reduced to 12.95 watts and voltage to 37 volts. (Image source: Silicon Labs) Class 0 1 2 3 4
PSE Pout Max [W] 15.40 3.84 6.49 15.40 30.00
Rcable Max [Ω] PSE Vout Min [V] PSE Iout Max [mA] Max Cable Loss [W] 20 44 350.00 2.45 20 44 87.27 0.15 20 44 147.50 0.44 20 44 350.00 2.45 12.5 50 600.00 4.50
Table 1: Cable power losses for PoE classes 0, 1, 2 and 3 (Type 1) and class 4 (Type 2). Silicon Labs supplies an evaluation kit for Si3459-based designs, the Si3459-KIT. While in normal operation the Si3459 is controlled by a host processor via the chip’s I2C interface, the kit includes a graphical user interface (GUI) making it easier to display and control the Si3459’s I2C registers. The evaluation kit requires a PC to control the evaluation board via the supplied GUI. The kit includes two Si3459 controllers supporting a 16-port demo system. Each port can supply 30 watts. When calculating the power requirements for a PoE system, it is important to take into account cable losses. In a Type 1 configuration, the specification allows for a maximum cable resistance of 20Ω (Rmax) between the PSE and PD (Figure 3). Additionally, the standard defines the PSE maximum output current (IPSE_out_max), PSE minimum output voltage (VPSE_out_min), and PSE output power (PPSE_out). This configuration results in around 2.5 watts in cable losses with a corresponding lowering in power and voltage at the PD. 10
power available for a Type 2 system; the power supply would need to supply 1.5 kilowatts (50 × 30 watts). Moreover, large commercial PoE+ systems typically include backup power supplies to cover for failure of the primary unit. However, in typical large-scale PoE+ installations, many PDs don’t require the maximum power the system can deliver. For example, devices such as Wi-Fi routers, VoIP phones, and LED lights require less than 10 watts. While this does lower the overall demand on the power supply, it does make it more difficult to configure the system’s power management. Chip vendors are easing the designer’s PoE+ power management burden by offering power management controllers. These integrated devices, such as Silicon Labs’ Si3484, supervise all the power requirements of multiport PoE+ implementations. The Si3484 is a power manager intended to supervise up to 64 ports powered by three ganged power supplies providing a single power source for the system. While
capabilities. However, large systems with dozens of powered devices require large power supplies and complicate the design. For example, consider a system with 50 powered devices all drawing the maximum
PD Pinmax [W] 12.95 3.69 6.05 12.95 25.50
(Image source: Silicon Labs) the Si3484 is capable of delivering 30 W to all 64 ports, it is primarily designed to configure systems with a mix of class 0, 1, 2, and 3 devices, as well as the class 4 devices used in Type 2 installations.
Figure 4: Silicon Labs’ Si3484 Power Management Controller works in conjunction with the company’s Si3459 Port Controller to control multiple power supplies and configure the output of multiple class 0, 1, 2, 3, and 4 ports. (Image source: Silicon Labs) Electronica Azi International | 2/2019
INSIGHT » PoE
The designer can configure the Si3484 power management controller via the chip’s SPI or UART interface to set the system power supply capacity, the port power configuration (Type 1 or 2), the port priority, the detection timing (which varies slightly between Alternative A and Alternative B), and the fault recovery protocol. Once programmed, the Si3484 operates without host processor intervention. Port and overall status information is available and continuously updated.
increases during operation, the increase can be accommodated – provided it doesn’t exceed the original grant. The downside is inefficiency because new PDs can’t access the unused allocation of existing grants (Figure 5a).
stressed. If the system is severely overloaded (as might happen if one of the three power supplies is taken off line) the Si3484 turns off all low-priority ports and then additional ports, one at a time in priority order, until the system is safe.
The Si3484 is designed to be used in conjunction with Si3459 PoE PSE port controller described above. The power management controller uses the real-time overload and current monitoring capability of the Si3459 to manage the power shared among 64 ports (Figure 4). PoE power management A single Si3484 power management controller can support up to eight Si3459 port controllers (each with eight ports) to construct an installation with 64 ports. The port controller looks after low-level port functions, such as detecting and classifying PDs, while the power management controller supervises the allocation of power across all ports. The developer can configure an optional power limit for each port to restrict the maximum amount of power the power management controller supplies to a particular device. If a PD’s power request is greater than the limit allocated to the port, the request is denied to avoid system overload. When additional PDs are connected to spare ports, the power management controller determines the likely power requirement from the classification of the PD. If there is sufficient overhead, power is supplied, otherwise the request is denied. The Si3484 can also dynamically adjust the amount of power granted to a PD during the course of a connection. In the event of port overload, the power management controller turns off the port. The Si3484 chip allocates power to each port using either a grant or consumptionbased policy, taking into account cable losses. Under a grant-based policy, ports are allocated a set amount of power whether it is used or not. Power for new PDs is allocated from the remaining power overhead. The benefit of this approach is that if the PD’s power consumption www.international.electronica-azi.ro
Figure 5a: The Si3484 can implement a grant-based power management policy whereby PDs are allocated a pre-set amount of power whether it is used or not. This allows flexibility of PD power consumption at the expense of system efficiency. (Image source: Silicon Labs)
Figure 5b: A consumption-based power management policy is more efficient and enables reserve and overload power allocations. (Image source: Silicon Labs) A consumption-based policy is more efficient, but could result in an overloaded port if the PD’s consumption exceeds the original allocation. To avoid repeated system overloads, the developer can specify a power reserve held back to service existing PDs if their power consumption rises above the original allocation, rather than being allocated to new devices. The developer can also configure the Si3484 to provide a power overload for a short duration. Such an overload is typically within the capability of modern power supplies provided it is not maintained for long periods (Figure 5b). During operation, if the system overload is less than the overload limit, the power management controller turns off ports in priority order until the system is no longer
Conclusion PoE and PoE+ enable Ethernet networks to carry power in addition to data. The addition of the IEEE 802.3at amendment to the standard has extended the reach of the technology by accommodating higher power consumption devices such as moving security cameras. However, multiple high-power ports on a large system demand large power supplies and careful power management to avoid system overload and damage. Power management controllers ease design and allow the developer to configure a multiport PoE system to precisely and efficiently meet the needs of the application. Digi-Key Electronics www.digikey.com
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DESIGN SOLUTIONS Âť INDUSTRIAL
Surge-Proof Your Industrial Sensor By: Michael Jackson & John Woodward, Maxim Integrated
Industrial sensors continue to get smaller and smarter while the environments in which they operate continue to grow bigger and more demanding. With thousands of pieces of equipment operating in close proximity to one another, their power supplies quickly become cross-contaminated. As a result, the regulated voltage levels may only bear a vague resemblance to their nominal values. In this design solution, we review the challenges faced by sensors operating in an industrial environment, common mitigation solutions, and their limitations. We then propose a simpler solution which provides increased robustness and reliability in a smaller area. THE SENSOR ENVIRONMENT Industrial sensors are used to monitor the status of a quantity of interest in an industrial process. For example, Figure 1 shows a proximity sensor being used to detect movement of raw material on a production line. Examples of other quantities measured using sensors include temperature and pressure. Sensors may be located anywhere on the factory floor. They are either analog or digital in nature and typically receive power from an isolated 24VDC voltage source. A controller (typically a PLC) receives information from a sensor through digital or analog I/O modules and sends an appropriate instruction to an actuator via a fieldbus. Many modern sensors include an IO-LinkÂŽ interface which allows the status of the sensor to be continually monitored, helping to improve factory throughput and enable adaptive manufacturing. IO-Link allows decisions to be made at the sensor level, eliminating the need to wait on the PLC. Figure 2 shows a typical industrial sensor system. The interface handles data transfer and routes the 24VDC power to a step-down voltage regulator. The regulator delivers either 5V or 3.3V to the microcontroller and to the sensing element. However, the 24V to 5V/3.3V down-conversion is a step that can be costly in terms of power loss 12
and space occupancy and may require lengthy custom design. In addition, the factory floor can be a very challenging environment, with long cables and strong electromagnetic interference resulting in highvoltage transients. Accordingly, the stepdown converter inside the sensor must be able to withstand voltage transients that are much higher than the sensor operating voltage (up to 50V).
Figure 1: Proximity Sensor Electronica Azi International | 2/2019
TRADITIONAL LDO SOLUTION If sensor current consumption is small, then an LDO solution is often considered for its benefits of small size and ease of design. However, this solution is very dissipative at only 21% efficiency (5V/24V). If the current is high, as with modern sensors (which typically consume currents of 10mA or higher), then this solution requires a bulky heatsink, and the LDO’s size advantage disappears. SWITCHER SOLUTION The most common alternative to the LDO is to use a high-efficiency switching regulator such as a buck regulator IC with discrete inductors, capacitors, and resistors. These have the advantage of much higher efficiency and consequently less heat dissipation - which becomes ever more important as sensors pack more functionality into ever shrinking enclosures. However, these can require knowledge-intensive, timeconsuming custom designs along with careful PCB layout to minimize space. More recently, regulator “modules,” which house the buck converter IC and the inductor in a single package, have become available. Figure 3 shows the component layout for a typical solution of this type (with a total component area of 47.2 mm2).
Figure 3: Buck Converter Module Component Layout
Figure 2: Typical Industrial Sensor System www.international.electronica-azi.ro
This module will operate up to a maximum of 40VDC input. While this may appear to provide a significant margin over the nominal 24VDC power supply, it will not function if a transient voltage exceeding this voltage occurs. A TVS diode is commonly used to protect an IC against transient surge voltages, however it is not an appropriate choice in this case. To allow the regulator to function unhindered at its maximum operating voltage (40V), the reverse breakdown voltage of the TVS must be close to this value. 13
DESIGN SOLUTIONS » INDUSTRIAL
One such TVS meets this criteria (SMAJ33A). However, its maximum clamping voltage is 53V, which may be reached in the event of a high energy surge. With a surge at this voltage, the regulator will no longer work and could potentially be damaged.
0.9V to 5V. Also, as shown in Figure 5, the efficiency of this regulator is in excess of 80% (at 24V input voltage), while it consumes a total component area of only 14.3mm2. This represents almost a 66% area savings when compared to the previous solution.
HIGHER VOLTAGE MARGIN For a sensor to be protected in the presence of surge voltages up to 50V it clearly requires a voltage regulator that will function up to this level. Figure 4 shows a solution that meets this criterion.
CONCLUSION We have discussed the challenges of quickly delivering higher power, more efficiently with minimum heat generation in ever smaller industrial sensors. We saw how a typical LDO solution falls short on efficiency while custom designs using switching regulator ICs can be difficult and time-consuming. We also showed how a power module with a 40V maximum input voltage is not robust enough for the modern industrial environment.
Figure 5: MAXM17552 Power Efficiency Figure 4: MAXM17552 uSLIC 5VOUT, 100mA Buck Solution Operating over an input voltage range of 4V to 60V, this micro system-level IC (uSLIC™) provides 100mA of output current with regulated output voltages of
this module robust in the harshest industrial, automotive, medical, and military environments. For higher loads (300mA) also operating off input voltages up to 60V, the MAXM15064 Himalaya uSLIC module is available in a 2.6mm × 3mm footprint.
ROBUST ENVIRONMENTS It is also important that power supplies are tolerant to mechanical stresses. This module meets JESD22-B103/B104/ B111 standards for drop, shock, and vibration. Additionally, hiccup overcurrent and overtemperature protection, combined with an operating temperature range of -40°C to +125°C, make
As a solution, we presented two rugged power modules with a 60V input voltage range which can operate in the most demanding industrial environments. Apart from industrial sensors, they are also suitable for use in motor encoders, HVAC, and building control applications. Maxim Integrated www.maximintegrated.com
BIOGRAPHIES Michael Jackson has over 20 years’ professional experience as an Analog IC Design Engineer and holds the position of Senior Technical Writer at Maxim Integrated. He has a MSEE from Dublin City University. John Woodward Graduated from San Jose State University with a Bachelor of Science degree in Electrical Engineering and is an executive business manager at Maxim Integrated. GLOSSARY PLC: Programmable Logic Controller. A ruggedized, microprocessor-based system that provides factory or plant automation by monitoring sensors and controlling actuators in real time. TVS: Transient Voltage Suppressor. Semiconductor device designed to protect a circuit from voltage and current transients. Typically implemented as a large silicon diode operating in avalanche mode to quickly absorb large currents. LDO: Low-Dropout Linear Regulator. A linear voltage regulator that operates even when the input voltage barely exceeds the desired output voltage. HVAC: Heating, Ventilation, and Air Conditioning. Industry term for the systems and technology responsible for the heating, ventilation, and air conditioning in buildings. HVAC systems regulate comfort (temperature and humidity), energy efficiency, and air. quality. LEARN MORE MAXM17552 4V to 60V, 100mA, Compact Step-Down Power Module (www.maximintegrated.com/en/products/MAXM17552) MAXM15064 4.5V to 60V, 300mA Compact Step-Down Power Module (www.maximintegrated.com/en/products/MAXM15064) Visit the Maxim Support Center (https://maximsupport.microsoftcrmportals.com/en-US/support-center) Find More Design Solutions (www.maximintegrated.com/en/design/technical-documents/ design-solutions.html) 14
Electronica Azi International | 2/2019
LED boost driver for low start-up voltage use Catalin Bibirica from Microchip Technology explains how to design different constant current DC-DC boost converters for multiple LEDs or a high-power LED using a constant current step-up regulator. A compact, high-efficiency, fixed frequency, step-up DC-DC converter optimized as a light-emitting diode (LED) constant current generator can provide an easy-to-use power supply, with a small number of external components, for applications powered by one-cell and two-cell alkaline, NiCd and NiMH batteries. It could be integrated in various applications starting from the basic one-LED driver, powered from one-cell alkaline, NiMH or NiCd, to multiple infrared, white and RGB LEDs. An example of this device is the MCP1643 from Microchip Technology. This is a pulse-width modulation-only device that operates at a fixed 1MHz switching frequency. Fig. 1 shows the device used as a simple DC-DC current source step-up boost converter that uses a resistor (RSET) to set the desired current. The input voltage determines the maximum LED current. The device has an operating input voltage from 0.5 to 5V with 0.65V start-up voltage. For a fully charged battery, the maximum regulated LED current is 450mA. Compared with alkaline, the NiMH and NiCd batteries have lower nominal voltage, so the maximum LED current delivered by the device will also be lower, around 350mA. The device will continue to deliver up to 150mA even when the batteries are almost depleted. As with all LED current drivers, there are some limitations regarding the maximum and minimum load current limits. The output LED current stays in regulation while VIN is less than VOUT with 300 to www.international.electronica-azi.ro
400mV headroom because of the boost topology. The maximum load current is determined by the input current limit, which is 1.8A. If the selected LED current forces an input current bigger than the device’s maximum peak current, the LED current will be unable to regulate and will fluctuate with input voltage. The battery must also be able to sustain the amount of current needed by the converter.
necting sense resistors in parallel. The device allows pulse-width modulation (PWM) dimming by turning the LED on or off with a variable duty cycle PWM signal applied to the EN pin. The maximum frequency for dimming is limited by the internal soft-start of typically 240μs. By varying the duty cycle of the PWM signal applied to the EN input, the LED’s average current is changing linearly and the light intensity changes as well.
Figure 1: Typical application for step-up DC-DC converter The minimum output LED current the device can regulate is 20mA. ONE-CELL LED DRIVER One of the simplest applications is as a constant current LED driver with a selectable current set by modifying the sense resistor’s value. For 2.4Ω, the set current is 50mA and can be increased to 100 and 150mA by con-
TWO SERIES LEDS DRIVER The device can also be used to drive two LEDs in series. However, the maximum voltage is limited by the overvoltage protection that restricts the output voltage to 5.0V. Because of this protection, it can handle two low-voltage LEDs, such as infrared for remote control and red, but cannot handle high-voltage LEDs, such as white and blue. 15
MCP1643 » LED BOOST DRIVER
PARALLEL LED DRIVER The device has a maximum output current of 550mA. To take advantage of this, lowcurrent LEDs can be paralleled. The maximum number of LEDs is determined by the maximum output current of the converter (550mA) divided by the LED current rating. For example, if the LED rated current is 50mA, up to 11 LEDs can be used. The same number of resistors is also required, with identical value. One pair, consisting of a LED and a resistor, is used to set the current measured by the device. The other pairs will follow, controlled by the first pair's current. This application is suitable for portable backlight devices where low-power SMD resistors are arranged in a line for LCD illumination. This low-cost, low-component count method replaces the need for a highvoltage constant current boost converter that may require a big inductor and occupy a lot of PCB space.
To use the device as a multiple independent LED controller, some conditions must be met: • The output must be moved from one LED to another with the same feedback resistor. • The device must be disabled and re-enabled each time the control system changes the current path. • The output voltage must be dropped to prevent any current overshoot when changing to a different LED color.
The enable signal is synchronised with these gate signals and has an additional enable period when no LED is controlled. During this period, the output voltage rises to a fixed voltage and the device acts like a voltage source. Importance must be given to the order of the enable signals. Starting the device without connecting the LED to its output will cause the device to increase the output
EMBEDDED SYSTEMS An RGB LED is made of three LEDs (red, green and blue) with a common cathode or anode that can be driven simultaneously or one at a time to form any color of the visible spectrum. Each color of the LED has a different forward voltage, so a current source is needed to drive each LED independently. The MCP1643 DC-DC converter can be used both as a current source for the highpower RGB LED and as a voltage source for a microcontroller. A one-cell AA battery can supply the power. The device has a maximum output current of 550mA, but only one output. To drive three LEDs independently, it must be controlled by a microcontroller. Using a softstart time of 240μs, the output can be multiplexed for each color without any current overshoot for an LED frequency of 70Hz. The LED current path has to be changed via external transistors to power each LED individually. In this application, the device can also be used for a brief period of time as a voltage source by disconnecting the LEDs and the feedback resistor and controlling the feedback voltage with a resistor divider to raise the output voltage to a fixed value of 4V. Considering that the device is also used to drive three LEDs and power the control system, the chip will be enabled at a frequency of around 300Hz (approximately four times 70Hz). 16
Figure 2: Theory of operation A PIC® microcontroller is required to accomplish this functionality. Figure 2 shows the timing of the control signals. The green, blue and red signals are the transistors’ gate voltages. These transistors are used to change the current path of each color. After they receive a command signal (gate voltage), the transistors will conduct and the corresponding color will form a closed current loop with the LED driver.
voltage to a maximum of 5V. If the LED is then connected into the circuit, the output capacitor will uncontrollably discharge into the LED, damaging the LED. The dead time between the enable signals is different because of the forward LED voltage difference. For positive voltage transitions from low to high voltage, the dead time can be eliminated, but doing so is not recommended. Electronica Azi International | 2/2019
INSIGHT » DC-DC BOOST CONVERTERS
DC-DC VOLTAGE SOURCE To use the device as a voltage source, a few external components are needed. A transistor must be added to disconnect the feedback resistor from the feedback loop of the current driver, and a resistor divider in the feedback loop can raise the voltage to an appropriate level used by the control system. When the LEDs are not connected but the device is enabled, the output voltage increases to around 4V in a short period of time. Because of multiplexing, the PIC microcontroller voltage is not regulated and will drop with time depending on the multiplexing frequency, the amount of stored energy and the power consumption of the control system. If a more regulated voltage is needed, the device can be followed by an LDO. For example, if a 3.3V supply is necessary, a low-quiescent current low-dropout regulator (LDO), such as the MCP1702, can be used, and the output voltage of the MCP1643 should be set to more than 3.6V. The voltage drop will not influence the functionality of the microcontroller with a supply voltage of 2.3 to 5V.
Additional components are also needed to avoid interfering with the LED’s control voltages. A Schottky diode can prevent any voltage from going back into the LED and a capacitor can store the energy when the device is driving the LEDs. Apart from not needing another DC-DC converter for the control system, this approach has another advantage. When the converter is turned off, the microcontroller will also be turned off. The entire system will only use the typical 1.2μA shutdown current of the device. The system can be restarted either manually by enabling the device – which will automatically power the microcontroller as well – or by an external voltage source applied to the microcontroller for at least 100ms. Figure 3 shows the electrical schematic of an RGB LED driver demonstration board. The schematic is divided into blocks that point to the functionality of each part of the system. The PCB layout should be done with respect to the general DC-DC converter’s rules: the power traces that carry the most amount of current should be as short as pos-
sible and should not pass under or close to any sense or high-impedance signal traces. The switching node must also be as short as possible to decrease interference. The input and output capacitors should be as close to the converter as possible and the use of a ground plane is recommended. For devices that tend to heat up, a lot of vias to a copper plane should be added to help with heat dissipation. CONCLUSION The MCP1643 is a versatile synchronous boost DC-DC LED driver converter designed for one-cell alkaline batterypowered applications with low start-up voltage and high current capabilities. The low standby (shutdown) current of 1.2μA increases battery life when not in use, while the low component count and low PCB area occupied allow for use with smaller, more portable applications. Designing DC-DC converters with the device is straightforward and, by attaching a microcontroller, the designs become more versatile and user-friendly. Microchip Technology www.microchip.com
Figure 3: RGB LED driver demonstration board electrical schematic www.international.electronica-azi.ro
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DESIGN SOLUTIONS » SAFE POWER
Safe power in magnetic resonance imaging environment Author: Patrick Le Fèvre, Chief Marketing and Communications Officer Powerbox
From the smallest to the largest, all electronic equipment requires power supplies, and with the increase in the amount of wireless connected devices deployed in the medical environment, electromagnetic compatibility (EMC) has become a big concern for all users. In the vast majority of applications the power supplies’ EMC is manageable, but in some extremely demanding areas such as Magnetic Resonance Imaging (MRI), the challenges for power supplies manufacturers are twofold, not to disturb the sensitive equipment, but also not to be disturbed by the multi tesla (T) magnetic field generated by the core of the MRI. How to guarantee that power supplies exposed to such extreme conditions will do the job?
FROM CONRAD ROENTGEN TO RAYMOND DAMADIAN As long ago as 1895 Conrad Roentgen found that an emitting discharge tube contained in a sealed box and radiating in the direction of a paper plate covered on one side with barium platinocyanide became fluorescent, and even when an object was placed between the tube and the plate a picture was obtained; the first X-ray. Fast forward to to 1977 and Raymond Damadian was performing equally groundbreaking experiments with his Nuclear Magnetic Resonance (N.M.R.) body scanner to produce much more detailed images of the inside of a human body. In both cases the images obtained have contributed greatly to improve medical diagnostics, the quality of treatment and peoples’ lives. From the original X-Ray equipment and the Damadian NMR to the latest MRI technology offering extremely high resolution imagery, all share a common need for a large variety of power supplies delivering from a few watts to multiple kilowatts. As the level of imaging resolution has improved, MRI manufacturers are designing new equipment placed very close to intense magnetic fields requiring very stable power that does not interfere with the data acquisition process. 18
Operating a switching power supply in very high magnetic field environments is very challenging and even reaches certain technical and physical limits as we know them today. To surpass these limits, power designers are exploring new paths, combining state of the art power conversion
topologies with advanced software and digital technologies. This is a very interesting area for power designers to explore but before revealing the magic power solution, let us understand how MRI works and what are the challenges power designers are facing in such extreme environments.
Figure 1: 1974 Damadian patent Electronica Azi International | 2/2019
INSIGHT » MRI - Magnetic Resonance Imaging
FROM DISCOVERY TO PRACTICE X-Ray equipment has contributed to impressive medical progress but the resultant images are limited to identifying solids, and exposure to radiation is dangerous for patients and operators. These drawbacks provided the original motivation for the physician and scientist Dr. Raymond Damadian to explore a new new way to scan the human body by researching the properties and behavior of an atomic nuclei when exposed to a magnetic field. After more than 10 years of research and a mix of successes and failure, in March 1972 he applied for a patent for an “Apparatus and method for detecting cancer in tissue” which USPTO granted in February 1974 (US3789832) (Figure 1). “An apparatus and method in which a tissue sample is positioned in a nuclear induction apparatus whereby selected nuclei are energized from their equilibrium states to higher energy states through nuclear magnetic resonance. By measuring the spin-lattice relaxation time and the spin-spin relaxation time as the energized nuclei return to their equilibrium states, and then comparing these relaxation times with their respective values for known normal and malignant tissue, an indication of the presence and degree of malignancy of cancerous tissue can be obtained.”
When the patient’s body is placed in a strong magnetic field the protons' axes all line up. This uniform alignment creates a magnetic vector oriented along the axis of the scanner (Figure 2.2). Depending on the object under observation, the MRI scanners have different field strengths, usually between 0.5 and 3 tesla (T) (note that the gauss unit is often used as well: 1 tesla = 10.000 gauss). The latest generation of MRI reach six tesla, thus Neurospin brain research is using 11.7 T, which is 234.000 times the Earth’s field, and in the case of spectroscopy even up to 20 T. The main magnetic field is referenced as vertical or B0 (B zero). When additional energy in the form of a radio wave is added to the magnetic field (B0), the magnetic vector is deflected. The radio wave frequency that causes the hydrogen nuclei to resonate is dependent on the element sought and the strength of the magnetic field (Figure 2.3). Two magnetics fields are used, the Gradient (B1) and the RF field. When the radio frequency source is switched off, the magnetic vector returns to its resting state, and this causes a signal (also a radio wave) to be emitted. It is this signal which is used to create the MR images.
Receiver coils are used around the body part in question to act as aerials to improve the detection of the emitted signal (Figure 2.4). The intensity of the received signal is then plotted on a grey scale and cross sectional images are built up (Figure 3). Multiple transmitted radio frequency pulses can be used in sequence to emphasize particular tissues or abnormalities. A different emphasis occurs because different tissues relax at different rates when the transmitted radio frequency pulse is switched off. This simple description highlights the level of the strong magnetic fields involved in the hostile environment of MRI applications, in which power supplies designers must take into consideration when developing products for such types of demanding applications. FORCES IN POWER To understand what power designers have to consider, it is important to understand the magnetic and electromagnetic forces involved with an MRI scanner and how they can interact with the power supply, which can also interact with the sensitive data collected by the different sensors.
When Nikola Tesla revealed the evidence of the rotating magnetic field in 1882, he could hardly have imagined that 90 years later it would lead to Dr. Raymond Damadian using a magnetic field to see inside bodies! And for sure, no-one could have imagined the level of resolution that modern MRIs have achieved. Let’s see at a glance how MRI works and how power supply designers have invented new power solutions able to operate in multi tesla environments. HYDROGEN NUCLEI ARE THE KEY IN MRI! As we learnt at school, the human body is composed of 70% water. Water molecules are made up of two hydrogen atoms and one oxygen atom (H2O). An MRI machine can identify hydrogen nuclei contained in water molecules, which have a quantum physics property called spin. We can assimilate the Hydrogen proton to the planet earth rotating on its axis, with a north and a south pole. Under normal circumstances, these hydrogen proton bar-magnets spin in the body with their axes randomly aligned (Figure 2.1). www.international.electronica-azi.ro
Figure 2: Hydrogen nuclei polarization during the MRI activation phases 19
DESIGN SOLUTIONS » SAFE POWER
MASTER MAGNETIC FIELD (B0) B0 is generated by a permanent or superconducting magnet and is oriented along the main axis of the scanner (Z axis). Depending on the application, field intensity varies from 0.5 T up to 20 T.
and better energy utilization, new generations of equipment have adopted switching power regulators, which paradoxically have improved power efficiency but have also became a source of potential disturbances! When the power supply is far enough from
components, saturating iron-cores and making it impossible to transfer the energy and even becoming a short circuit. GRADIENT FIELDS (B1) The gradient field frequency is very much the same as the average switching frequency of conventional power supplies but induces a ‘current storm effect’ in cables and conductive areas. This also affects the switching performance of the power stage resulting in signal distortion, heat and in most of the case short circuit of the switching components. RF FIELD Due to its much higher frequency, the RF field is less harmful for the power supply though induced currents could result in the form of similar collateral defects as generated by the B1 field.
Figure 3: Brain high resolution picture obtain after data acquisition GRADIENT FIELDS (B1) B1 is generated by a specific combination of coils in the three axis X, Y and Z. The pulsed frequencies are around 100 KHz with intensity as low as few mT/m. The frequency is adjusted to suit the object being examined and the frequency can be modulated. RF FIELD The RF field is generated by a separate coil in the X and Y-axis. The frequency range is comprised between 64 MHz and 299 MHz with micro-tesla intensities. HOW TO PROVIDE POWER IN SUCH ENVIRONMENTS? To avoid interference the best practice in powering MRI is to avoid alternative voltage/current (AC) and to only use continuous voltage/current (DC), even for lighting. Master power supplies are traditionally positioned outside the shielded operation room and the DC voltage distributed to the electronic equipment via shielded cables. To adjust the voltage from the main DC line to a specific load (e.g. 24 VDC to 12 VDC), the old generation of MRI equipment used a large variety of linear step-down voltage regulators, which reduces the risk of disturbances but inherent to their technology have a very low energy efficiency and high power dissipation. Requiring more power 20
B0 and sensitive equipment, efficient shielding and grounding can prevent interference but when the power supply is located close or even within B0, then power designers are facing real challenges. MRI IMPACT ON THE POWER SUPPLY MASTER MAGNETIC FIELD (B0) A switching power supply transforms a DC voltage into an AC one, and then rectifies it to DC. During the conversion process the transferred energy is stored in a transformer composed of a coil(s) and a core, usually made of ferrite. The high density of B0 interacts directly with all ferromagnetic
POWER SUPPLY IMPACT ON MRI MASTER MAGNETIC FIELD (B0) Even though the Larmor frequency is 42.58 MHz/Tesla for protons (hydrogen nuclei), there is a risk that the power supply switching spikes can impact the signal with the consequence of generating artifacts that affect image quality and resolution. GRADIENT FIELDS (B1) Because the switching frequency of a standard power supply is in the same range (100 KHz) of the gradient filed, that could interfere with the signal generated by the gradient loop, and as a consequence modify the encoded signal, resulting in image artifacts. RF FIELD In the case of RF, the harmonics of the fundamental switching power supply could interfere with the RF coil loop causing alteration of the MRI RF signal and a negative effect on image quality.
Figure 4a: Triple outputs, multi-phases, PRBX coreless power supply sustaining B0 field Electronica Azi International | 2/2019
INSIGHT Âť MRI - Magnetic Resonance Imaging
low inductance values, which can be compensated by designing a multi air-cored power stage operating in parallel. Controlling multi-parallel air-cored power supplies requires the implementation of the latest digital control technology, offering a high degree of flexibility in how the different power channel operate. Digital control allows designers to adapt the profile of the power supply to specific conditions. In Figure 4a is an example of an advanced aircore power supply, the PRBX GB350. To accommodate the specific MRI, B0, B1 and RF specifications that it has been designed
Figure 4b: PRBX coreless power supply sustaining B0 field shielded to protect against interferences
for, the GB350 has a fundamental switching frequency of 600kHz. With such a switching frequency and its four phase interleave mode, the GB350 has a resultant output frequency of 2.4MHz. This allows
easier filtering and extremely fast regulation response times. The unit also includes EMI shielding to lower radiated emission and prevent any risk of artifacts (Figure 4b). IN CONCLUSION In less than 50 years, the progress of the Magnetic Resonance Imaging (MRI) scanner has been really impressive and image resolution quality, astonishing (Figure 5). By permanently innovating, the power supply industry has contributed to delivering efficient, sustainable and safe power to very demanding applications such as B0 field conditions. Ultra-high field strength systems with a new generation of sensors will require extremely fast response power sources switching at 25 MHz to avoid harmonics in the safety band and I can foresee a new generation of coreless power supplies combining air-core, digital control and the use of Gallium Nitride (GaN) transistors. There is no doubt, power designers developing power solutions for medical imagery systems will continue to make magic a reality! Powerbox (PRBX) www.prbx.com
Source: iStock / baranozdemir / PRBX
HOW THEN, TO MAKE A POWER SUPPLY THAT WORKS? Taking into consideration the different parameters, it is obvious that a suitable power solution will have to exclude ferromagnetic components and its switching frequency must not interfere with the MRI signals. Because conventional magnetic cores will saturate when exposed to the B0 field energy, air-core inductors, having no ferromagnetic core material, should be considered. One downside of air-cored inductors is their
Figure 5: MRI equipment with advanced data acquisition requires very stable power supplies able to operate in high magnetic field www.international.electronica-azi.ro
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APPLICATIONS » SWITCHES
High performance switches for e-cigarette and vaping applications There is no doubt that smoking is bad for you and, as a result, an increasing number of smokers are turning to vaping to help kick the habit. According to the World Health Organization (WHO), the number of tobacco smokers in 2017 decreased by 40 million to reach around 1.1 billion. Meanwhile, market research company Euromonitor estimates that the 7 million people that were vaping in 2011 will increase to almost 55 million by 2021. Unsurprisingly, the rapid increase in the number of people vaping equates to a large business opportunity. According to an August 2018 study by Grand View Research, Inc. the market will be worth $47.11 billion by 2025. It is forecast to grow at a CAGR of 23.8% with the USA representing by far the biggest share of the global market and modular devices being the most popular type of vaping product.
There are three principal types of vaping device; e-cigarette, vape pen and modular (‘box mod’) devices. E-cigarettes are the simplest and in many cases they are fully automatic as a sensor detects when the user ‘takes a drag’ and releases the vapor. Other types use a small switch in place of the sensor. In general, e-cigarettes are not refillable and are disposed off after use.
Vaping pens usually consist of a refillable cartridge / tank that holds the juice and a battery section. In all cases, these rely on the user pressing a small switch to activate the heating element and release the vapor. The final category (and the most complex) is the modular devices known as ‘box mods’ where the tank, housing and batteries are generally all separate and interchangeable.
Figure 1: Vape pens rely on a single press switch to operate the heating element 22
Electronica Azi International | 2/2019
INSIGHT » e-cigarette and vaping applications
These are the most powerful and are often programmable in terms of the wattage delivered to suit different types of heating coil. In box mods, there are often several small switches to program parameters, as well as the main heater control switch. The switch is one of the most important components in all of these devices as, if it
The physical switch size is important to fit the small package, as is moisture resistance to protect against spilled juice and moisture from everyday use. How the switch sounds and feels (its ‘haptics’) is a key part in defining how a user perceives their vape device, whether it is cheap and low quality or a premium device.
(‘tact’) switches that are popular in vaping devices, either as standard off-the-shelf devices or as the basis of a custom solution tailored to meet a specific need. Disposable e-cigarettes benefit from the cost effectiveness of tact switches such as the PTS series while higher performance switches
Figure 2: Box mods require several switches to operate and program the devices
Typically used for e-cigarettes
KMT0
KXT
Typically used for vaping pens and box mods
PTS810
PTS830
PTS647
PTS645V
Figure 3: C&K tact switches are very popular in vaping applications due to their small size, reliability and tunable haptics fails, the device is inoperable. As such, choosing the right switch for each application is critical for vaping device manufacturers working with vaping market brands which are keen to build a loyal customer following. In general, when selecting a suitable switch, designers look for a high cycle count rating as the switch may be used hundreds of times each day. www.international.electronica-azi.ro
As such, vape manufacturers pay a lot of attention to this aspect and work with sophisticated manufacturers such as C&K Switches that have a dedicated laboratory to tune haptics to meet a manufacturer’s specific needs. C&K has over 55,000 standard products and 8.5 million switch combinations, including their ultra-small and highly reliable tactile
such as the KMT0 and KXT offer a wider range of high reliability options for more sophisticated vape pens and box mods. C&K | www.ckswitches.com
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Considering Home Wireless Connected Lighting? You want to control your lights wirelessly. How do you know which wireless technology to use? In this article Silicon Labs will provide insight into home wireless connected lighting. Trends in wireless technologies, protocols, and a home connected lighting application is presented. HOME WIRELESS CONNECTED LIGHTING MARKET According to research firm IHS Markit, the residential smart lighting market was valued at $1B in 2015. IHS projects the market to expand at a 30% compound annual growth rate from current 2015 to 2020 globally. Connected lighting and home automation presents challenges to early adopters and innovative entrepreneurs. Market makers must design simple, flexible, reliable lighting control solutions that feature security, future proof updates, and an ecosystem with device interoperability. Designers want to know which wireless protocols are best suited for wireless connected lighting. 24
WIRELESS PROTOCOLS FOR CONNECTED LIGHTING CONTROL Wi-Fi connectivity is ideal for high data rate products and services in the connected home, and for providing connectivity to the Internet cloud via home gateways. However, Wi-Fi is not suited for lighting networks due to Wi-Fi’s large protocol stack,
memory and processor power requirements, and its star network topology. Several different wireless technologies, shown in Figure 1, are available in this market to address elements of wireless lighting control. Wi-Fi, Bluetooth, ZigBee and Thread for mesh networking, and proprietary sub-GHz protocols, address lighting control needs.
Figure 1: Wireless Protocols Electronica Azi International | 2/2019
INSIGHT » COMPANIES
This requires some fundamental building blocks to be in place, but opens up opportunity for future proofing existing products. There are two primary cases for switched multiprotocol; Future-Proofing and Commissioning.
Mesh networks provide a communications backbone that allows a wide variety of connected wireless devices, such as Smart LED lights, switches, thermostats and sensors. Bluetooth enabled devices in a connected home provide direct connectivity to smartphones applications providing device control without the power consumption of WiFi, However, Bluetooth/BLE has a limited network device count, lacks scalability and the benefits of a mesh network. ZigBee networking technology is a local mesh network based on the 802.15.4 standard that is scalable to hundreds of devices. The ZigBee cluster library defines features of smart lights and home automation devices that provide control of Smart light of dimming, RGB color, and color temperature. The ZigBee mesh networking along with cluster libraries is ideal for lighting control. However, direct smartphone control isn’t supported. The ZigBee gateway router is required to serve as a bridge to connect ZigBee devices to a Wi-Fi or Ethernet IPbased LAN network enabling Internet control and cloud connectivity. Thread is an emerging mesh network technology that provides IPv6 networking protocol built on open standards for low-power 802.15.4 mesh networks that can securely connect hundreds of devices to each other and directly to the Internet Cloud. Thread 1.1 is emerging so only a small number of www.international.electronica-azi.ro
thread-based devices are available. Thread devices are able to run the ZigBee application layer which provides interoperability with the available ZigBee home control devices. “A key strength of the ZigBee Alliance's technologies is our application layer - the only mature, widely deployed, interoperable and open IoT application language” said Tobin Richardson, President and CEO of the ZigBee Alliance. Finally, Proprietary protocols are used in closed ecosystems. Multi-band radios may be used to provide sub-GHz bands instead of 2.4GHz, which can provide a longer range and improve propagation in homes. MULTI-PROTOCOL IN LIGHTING APPLICATIONS The evolution of embedded wireless SoCs with multi-protocol stacks is becoming a differentiator to provide product upgradeability, better user experience, and enhanced use cases for connected lighting designs and home automation. A multi-protocol application for Bluetooth/BLE is for commissioning a device to join a network, which may be running both ZigBee or Thread and Bluetooth at the same time. Switched Multi-Protocol in an implementation of a multi-protocol platform that provides the ability to change which wireless protocol is supported by bootloading a new firmware image while the device is deployed in the field.
Future Proofing. The IoT is an evolving market for device manufacturers. There are many wireless protocols available currently and under development. It is difficult to determine which one will deploy, dominate, or become the defacto standard in their markets. A device manufacturer may plan to sell their device into different ecosystems or may plan for an ecosystem change over time. A light bulb manufacturer may ship Bluetooth enabled light bulbs so that consumers can immediately directly control their lights from their smartphone via a supplied app. In the future, the consumer may purchase a home automation system that uses ZigBee or Thread or some proprietary protocol and may wish to add the light bulb into that ecosystem. An ecosystem may deploy ZigBee networking today, but may switch to Thread protocol later when their application layer and IPv6 features are mature. The recent Bluetooth Mesh feature announced in Bluetooth 5.0 will offer a Mesh alternative to Zigbee and Thread. Implementing multiprotocol solutions will provide an upgrade path for future proofing. Commissioning via Smartphone. A device manufacturer will chose a wireless protocol for lighting control, however they may want to use a smartphone app to commission devices onto the network. Implementing Smartphone control requires a Bluetooth commissioning application on the device; a commissioning application on a smartphone; and a Bluetooth application with network authentication on the Home Gateway.
Figure 2: Switched Protocol – BLE commissioning on mesh network 25
INSIGHT » COMPANIES
Using the smartphone app the user can authenticate the device to join the network, set up a pairing with other lighting or home automation devices in the network, then switch over to the ZigBee or Thread wireless stack that the network is running. Each wireless network will have its own mechanisms for joining and pairing devices, but all can be accommodated with this mechanism. In Figure 2, the smartphone uses a BLE connection to the wireless lightbulb to commission the device on the ZigBee or Thread network. The user operates the smartphone app to get the device joined onto the network, set up BLE pairing with other appropriate devices in the network, then switches over to ZigBee or Thread mesh network stack used by the lighting control network. WIRELESS SOC AND MODULES DELIVER MULTI-PROTOCOL PERFORMANCE The system-on-chip implementation is the critical device to support wireless standards, ensuring interoperability among connected devices supporting these standards. The SoC device must have adequate flash memory to be able to store multiple protocol stacks in firmware and to enable dynamic switching among the protocols as devices join the network. Equally important is the application layer software that connects the end user to the hardware. Leading SoC vendors are offering comprehensive hardware, protocol stacks, and software development tools to support the design of multi-protocol devices. This unified hardware and software approach to multiprotocol connectivity will ensure seamless interoperability of wireless lighting devices and sensors. Silicon Labs EFR32MG1B132F256GM48B0 1.85 → 3.8V Wireless MCU, Thread, ZigBee, ZigBee RC
RS Stock # 915-6512 Mfr. Part # EFR32MG1B132F256GM48-B0 Brand Silicon Labs The Silicon Labs Mighty Gecko EFR32MGxxx32Fx SoCs feature a 32-bit ARM Cortex-M4 processor core with a highly integrated radio transceiver supporting various 2.4GHz wireless protocols. Typical applications involve home and building automation and security, metering, industri-
Author: Bogdan Grămescu https://ro.rsdelivers.com 26
al automation, commercial and retail lighting and sensing. The devices are ideal for any battery operated application and other systems requiring high performance and low energy consumption.
Wireless Starter Kit, RS Part No. 915-6604. The starter kit is required to gain access to the ZigBee® and Thread software stacks.
Silicon Labs’ Mighty Gecko family of SoCs is ideal for designing energy-friendly wireless connected IoT devices. Part of the Wireless Gecko portfolio, the Mighty Gecko is the superset part and supports 2.4GHz and Sub-GHz protocols, including Zigbee, Thread, BLE, and Silicon Labs Connect stack for 2.4GHz, as well as Sub-GHz for proprietary protocols and the Connect stack.
Silicon Labs’ MGM111 Mighty Gecko Module is a pre-certified module with a Mighty Gecko wireless SoC that saves months of design and development effort.
• 40MHz 32-bit ARM Cortex-M4F core MCU with up to 1MB Flash memory, up to 256KB RAM • RF Frequency Range: 2.4GHz ISM band • RF Output Power: up to +19.5dBm • Integrated DC-DC converter with RF noise mitigation • 12-channel Peripheral Reflex System enabling autonomous interaction of MCU peripherals • Hardware Crypto Accelerator and True Random Number Generator • Protocol stack: ZigBee, Thread, ZigBee RC. Also Bluetooth Smart and Proprietary on Performance parts Silicon Labs Mighty Gecko 2.4GHz RF Transceiver Add On Board for MGM111A
RS Stock # 124-3498 Mfr. Part # SLWRB4300B Brand Silicon Labs The SLWRB4300B Module Radio Board allows the MGM111A 2.4GHz wireless module to be evaluated using the SLWSTK6000A
The MGM111 is based on the EFR32 Mighty Gecko SoC, a highly integrated, energy efficient device that includes an ARM Cortex-M4 with DSP extensions and an FPU, and a 2.4 GHz radio with support for wireless mesh networking using the ZigBee or Thread protocols for low-power wireless applications in the lighting, connected home, building automation. • 40MHz Cortex-M4F core wireless SoC with 256KB Flash memory, 32KB RAM • RF Operating Frequency: 2400-2483.5MHz • RF Output Power: up to +10dBm • Receiver Sensitivity: -99dBm @ 62.5ksymbol/sec, OQPSK with DSSS, PER 1% • Modulation: OQPSK • Supported Protocols: ZigBee, Thread • Cryptographic engine with support for AES-128/-256, ECC, SHA-1 and SHA-256 • Random Number Generator • Real-Time Clock • Chip antenna with balun • Ultra-low power operating modes • Fast wake-up time with Wake-on-Radio • Power supply: +1.85V to +3.8VDC • Operating temperature range: -40 to +85°C • Dimensions: 45 mm × 30mm
Aurocon COMPEC authorised distributor for RS Components Electronica Azi International | 2/2019
SENSORS FOR MOBILE MACHINERY important for motion control and safety systems. Relying on MEMS technology and gravity for their measurement, these sensors have no exposed moving parts, resulting in easy installation and a high level of environmental protection. ■ High Accuracy of 0.1° and Resolution of 0.01° ■ Measurement Range ±80° (Dual Axis) or 360° (Single Axis)
PRODUCTS
High Precision IXARC Rotary Encoders Motion control applications – ranging from factory automation to mobile machinery – require accurate, realtime information about the location of mechanical components. The IXARC line of absolute rotary encoders provide precise and reliable measurement of the angular positions of joints, drive shafts, pulleys, etc. A range of electronic connections, ranging from simple analog or incremental outputs to sophisticated Fieldbus and Industrial Ethernet interfaces, are available. ■ Thousands of Absolute and Incremental Encoders with up to 16 Bit Resolution ■ Large Variety of Electrical Interfaces Dynamic TILTIX Inclinometers For dynamic movements with rapid acceleration, POSITAL’s Dynamic TILTIX inclinometers should be used. They are based on a 3D MEMS accelerometer and a 3D MEMS gyroscope. A smart algorithm combines the signal of the accelerometer and gyroscope to eliminate the effect of acceleration (e.g. due to rapid motion of the equipment), vibration and shock. ■ Accuracy: Dynamic 0.5°, Static 0.3° and Resolution of 0.01° ■ Measurement Range ±90° (Dual Axis) or 360° (Single Axis) Precise Industrial TILTIX Inclinometers The accurate measurement of tilt or inclination is very
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Versatile LINARIX Sensors Many applications require linear motion to be monitored for system control or to ensure safety. With lengths ranging from 1 m to 15 m (3’ to 45’), LINARIX draw wire sensors are available in many configurations to meet application requirements. Options include a wide variety of outputs (including analog, Fieldbus and Ethernet variants), heavy duty housings and compact designs. ■ Absolute Position Measurement with Resolutions up to 2μm and Range up to 15m
BENEFITS High Precision IXARC Rotary Encoders provide a resolution of up to 16bit for both magnetic and optical types. TILTIX Inclinometers offer a static accuracy level of 0.1° over a wide temperature range. ■ Encoders with 16 Bit Resolution ■ Inclinometers with 0.1° Accuracy and 0.01° Resolution Functional Safety Safety encoders offer the advantages of increased personnel safety and minimize the risk of machines malfunctioning. IXARC safety encoders are certified to Safety Integrity Level 2 (SIL 2) and Performance Level d (PL d). POSITAL also offers redundant encoders which can reach a safety level of PL d, Cat. 3. These encoders use a combined measurement design consisting of one optical and one magnetic system. ■ Certified Safety Level (SIL 2, PL d) ■ Redundant Encoder Designs ■ Wide Range of Electrical Interfaces Tough Sensors For Tough Jobs Both encoders and inclinometers are available in heavy duty designs with a protection class of up to IP69K.
Electronica Azi International | 2/2019
Stainless steel versions are also available. Encoders can withstand shaft loads of up to 300N and offer a shock resistance of up to 300g. Most products cover a temperature range from -40°C to +85°C. ■ High Protection up to IP69K ■ Up to 300N Load and up to 300g Shock ■ -40°C to +85°C Temperature Range Explosion Proof Encoders And Inclinometers POSITAL explosion proof sensors are designed to operate safely in environments with potentially dangerous levels of explosive gases or dust. IXARC ATEX encoders have been certified in compliance with IECEx and ATEX directives and can be installed in zones 1 and 21. ■ Certified in Compliance with IECEx and ATEX Directives for Different Applications and Zones ■ Wide Range of Electrical Interfaces APPLICATIONS Mobile Cranes
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Position data is required in cranes and other construction machinery to ensure safe, efficient and reliable operation. Mobile cranes or trucks with long boom extensions - such as fire trucks or concrete pumps – have to reach to highrise buildings, often over large obstacles. IXARC rotary encoders can be mounted directly on the rotational joints to provide data for active damping systems. TILTIX single or dual axis inclinometers can be used to monitor the position of the boom arm or for base leveling. ■ IP69K Sensors, High Pressure and Temperature Resistant ■ Sensors for High Levels of Shock & Vibration ■ Easy Communication with Analog, CANopen or J1939 Interface To improve productivity, precision and safety, Excavator inclinometers are mounted on the boom, dipper arm, rotating platform and bucket to monitor the position during the operation. They are well protected in a robust metal housing with IP69k protection class, can withstand high shock and vibration and can be operated over a very wide temperature range. ■ Dynamic and Precise Static Inclinometers ■ CANopen, J1939 and Analog Interfaces ■ Up to IP69K, -40 to +85°C www.oboyle.ro
Magnetically or RFID-coded safety sensors Many systems and machines require safety devices to prevent unauthorized access or intervention during operation. A simple light grid is in many cases not sufficient, for example to prevent the escape of noise, heat, dust, etc. from inside presses, robotic cells or injection molding equipment. Conversely, in the food and pharmaceutical industry, hygiene requires that systems must be protected from penetration by foreign bodies. Various doors, hoods or flaps offer a solution. Their position can now be reliably detected with a magnetically or RFID-coded, Ecolab-certified safety sensor from Contrinex. Since operation is contactless, the sensor is not subject to wear and maintenance intervals can be longer. A magnetically coded system (Type 4 according to ISO 14119) not only makes the YSM sensor series immune to mutual influence from other devices, but also highly resistant to on-site tampering. In the RFID-coded version (YSR series), up to 30 sensors can be connected in series with just one relay or controller. With switching distances of 4 www.international.electronica-azi.ro
mm up to 18 mm, these magnetically coded sensors also work behind a stainless-steel cover. This allows for very safe system design, e.g. with the mechanism covered, and easy cleaning of all open surfaces. In addition, the sensor system meets the requirements of IP6K9K, which means it is dustproof and watertight, even when exposed to cleaning at high pressure and with steam. This makes the safety sensors ideal for food and pharmaceutical applications. The RFID code of the YSR type can either be randomized or taught. External device monitoring (EDM) and a feedback signal are also available. With dimensions of 36 mm × 26 mm × 13 mm or 88 mm × 25 mm × 13 mm (L × W × H), the sensors are very compact and can be mounted both frontally and at a 90° angle. M12 plugs or PVC cables are available as connection variants. www.oboyle.ro 29
FUJIFILM PRESCALE: Pressure measurement film This is the only film in the world that can measure pressure. Pressure and pressure distribution, which could not be visually observed in the past, can now be easily confirmed.
Prescale allows you to easily measure pressure balance, distribution, and size. Created using Fujifilm's advanced thin film coating technologies, the pressure inspection sensor on the entirety of the film allows you to confirm pressure distribution of the entire surface at a glance. The color appears red where pressure is applied, and the color density varies according to the amount of pressure. To cover a wide pressure range (0.006 to 300 MPa), we supply eight types and nine variations of Prescale. Prescale Sheets make pressure measurement more readily accessible. Prescale Sheets are a version of Prescale that are pre-cut into easy-to-use sizes. It is recommended for first-time users and for small-scale applications. To cover a wide pressure range (0.2 to 300 MPa), we supply six types of Prescale Sheets.
pressure range. Each product is made for a certain pressure range (MPa). Customers must confirm the pressure value of their application environment. Structure of Prescale There are two types of Prescale: the two-sheet type and the mono-sheet type. The two-sheet type is composed of two films of which Two-sheet type are respectively Ultra Extreme Low Pressure (5LW) ~ coated with color- Medium Pressure (MW) forming material and color-developing material. This type is used by placing the sides Mono-sheet type coated with the Medium Pressure (MS), High Pressure chemical agents (HS), Super High Pressure (HHS) over each other. The mono-sheet type is a film with a single base film with a coating of color-forming material and developer. Continuous pressure Pressure range: Medium pressure (10~50MPa) Pressure Measured pressure application reaching time: 2m conditions: Measured pressure holding time: 2m Standard color sample
Measure tire pressure
Measure the pres- Measure the pressure distribution of sure between cleaning polish cylinder heads and against LCD panels cylinder blocks
We supply eight types and nine variations of Prescale and six types of Prescale Sheets for use depending on the
Momentary pressure Pressure range: Medium pressure (10~50MPa) Pressure Measured pressure application reaching time: 5s conditions: Measured pressure holding time: 5s Standard color sample
Pressure chart (for medium-pressure [MW]) By checking the standard chart, the pressure value can be confirmed visually. * The parts represented by the dotted lines may exceed the allowable error range, so it should only be used as a reference. * Prescale is used by selecting curves A, B, or C depending on the temperature and humidity conditions. * The measured pressure reaching time for continuous pressure of Ultra extreme low pressure (5LW), extreme low pressure (4LW), and ultra-extreme low pressure (LLLW) is 5 seconds, and the measurement maintenance time is 2 minutes. * Super high pressure (HHS) is only for continuous pressure.
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Electronica Azi International | 2/2019
How Prescale works The microcapsules in the color-forming layer are broken by pressure, and the colorless dye is absorbed into the developer, causing a chemical reaction to produce a red color. The microcapsules containing the color-forming material are adjusted to varying sizes and strengths, and is coated uniformly, producing a color density that corresponds to the amount of pressure. How to use Prescale 1. Cut the Prescale or Prescale Sheets into the shapes needed for measurement. 2. Insert the Prescale between the surfaces to be measured. Apply normal operating pressure.
3. Remove the Prescale.
4. You can now see the pressure and its distribution.
5. Use the special scanner to scan the colorized Prescale sheet.
Overall measurement
Partial measurement
6. Use the included Pressure Distribution Mapping System FPD-8010E to perform analysis. Wire frame By selecting measurement conditions, you can take measurements of the pressure values of analysis can be perentire objects, partial sections, and precise points. formed by using 3D The data export function can be used to export analysis software. data in Excel format, and three-dimensional image www.oboyle.ro
Leuze electronic nominated for the “Best of Industry Award 2019â€? With its "Smart Process Gating" muting process, which does not use signaling sensors, Leuze electronic is qualified as a winner of the 2019 GIT Security Award for the "Best of Industry Award 2019". In 2019, the "Best of Industry" awards will be presented by "MM Maschinenmarkt" for the "Smart Process Gating" is based on fourth time. A jury of experts and the online community of the specialist media award the prize the MLC 530 safety light curtains to outstanding products and innovative concepts. Amongst the nominees are products and from Leuze electronic technologies from companies that have already won an industry award or were nominated for one. The readership and the expert jury each have 50% of the votes in the decision. The jury consists of experts from industry and research as well as specialist editors from "MM Maschinenmarkt". Leuze electronic has been nominated as the winner of the 2019 GIT Security Award in the "Safe Automation" category with its "Smart Process Gating". This is a new process from Leuze electronic, based on the MLC safety light curtains, which make access guarding with material transport cheaper, simpler and safer. For example, in intralogistics, as well as in the automotive and packaging industries, material locks on conveyor lines often have to be protected against unauthorized access by means of optical safety sensors. Previously, muting processes with muting sensors were required in order to clearly identify when transported goods are approaching a protective field and to bridge the passing of these goods through the protective field at the correct moment. The SPG (Smart Process Gating) method developed by Leuze electronic is an innovative alternative, and it eliminates the need for signal-emitting sensors. Process-controlled access guarding with Smart Process Gating in intralogistics Based on the MLC safety light curtains, conveyor systems can thus be made more compact. The risk of misalignment or damage to the sensors is eliminated as are the costs for their maintenance and servicing. The MLC 530 safety light curtain variant with Smart Process Gating (SPG) is TĂœV-certified for safety. The achievable performance level of the solution is attained in conjunction with the system control that is used: PL d (with standard control) or PL e (with safety control). Online voting started on March 25th. Interested voters can vote for their favorites and win valuable prizes themselves: www.maschinenmarkt.de/best-of-industry/voting. www.oboyle.ro www.international.electronica-azi.ro
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SAKI Corporation Introduces Ultra-fast, Inline, 2D Bottom-side automated Optical Inspection for PCBs By: Ikumi Sugawara, email: sugawara.ikumi@sakicorp.com, Saki Europe
Featured at NEPCON China and SMTconnect Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki’s 2D linescan technology is ultra-fast, capturing the image of an entire 460×500mm printed circuit board assembly (PCBA) and 610×610mm as a carrier size in one pass, in real time, storing the image into memory, and creating inspection data for the entire board. This versatile system automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes. The 2Di-LU1 software includes Saki’s proprietary Fujiyama algorithm, which provides complete throughhole joint inspection in a single step. It simultaneously inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems, and bridges. Saki’s inspection software has been used for extra component detection of solder balls and foreign objects and through-hole device inspection in the automotive industry for several years and complies with the IPC-A-610 standard. “Incorporating bottom-side AOI into the assembly process increases productivity by reducing the time, costs, labor, and floorspace needed for manual inspection, additional conveyors, or equipment to flip the board,” explained Yoshihiro Akiyama, Chief Technical Officer (CTO), Saki Corporation. “Saki’s system speeds the inspection process, increases throughput, and eliminates extra PCBA handling and the risk of substrate damage.” The platform and construction of the 2Di-LU1 bottom-side AOI system is based on Saki’s rigid, time-tested hardware that ensures very stable machine performance and long hardware life. The system supports L-size PCBs, high clearances, heavy and substrates. Saki will feature its 2D bottom-side AOI system, along with its 3D AOI, SPI, and AXI systems and Saki Self-Programming Software, at NEPCON China, Shanghai, China, in the Saki booth 1J30 and the Fuji booth 1G60, being held April 24-26 and at SMTconnect, Nuremberg, Germany, in Hall 4A133 being held May 7-9. For more information contact Saki at sakicorp@sakicorp.com or sales.us@sakiglobal.com, or visit our website at www.sakicorp.com or www.sakiglobal.com. LTHD Corporation S.R.L. Head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., lthd@lthd.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, Fax: +40 256 490813
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LTHD Corporation S.R.L. Head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., lthd@lthd.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, Fax: +40 256 490813
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Electronica Azi International | 2/2019