SURFACE SPRING 2026
Newsletter
Surface imaging, analysis & metrology news from Digital Surf
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IN THIS ISSUE
COPLANARITY AND WARPAGE ANALYSIS: BOOSTING RELIABILITY IN ELECTRONIC ASSEMBLIES
SEMICONDUCTORS NEW MOUNTAINS® 9.3 Coplanarity warpage Acceleratingand surface analysis analysis for reliable electronic automation... and much more assemblies
APPLICATION
Force spectroscopy: Bringing next-generation head-up displays to life acid Strengthening polylactic polymers by calcification
HOW TO FEATURE SPOTLIGHT Improve particle segmentation Welcome the fascinating in electronto microscopy images with artificial intelligence world of fiber analysis
SURFACE SURFACE METROLOGY METROLOGY Q&A Q&A What can I do with a freeform surface? What cut-off value should I use?
EVENTS SOCIAL NEWS && SOCIAL Trade review Eventsshow highlights What’s hot online What’s hot online
As electronic assemblies shrink, tiny geometric deviations can cause major failures. Coplanarity and warpage analysis brings precision to quality control through accurate 3D metrology. With solutions such as Mountains® software, manufacturers can detect solder ball issues early and automate defect detection, improving yield, preventing failures and strengthening reliability in semiconductor and advanced electronic packaging applications.
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WEBINAR SURFACE NEWSLETTER // DIGITAL SURF // SPRING 2026
… Turn to page 2 … Did you know there is a whole host of free webinars waiting for you on the Digital Surf website? Head on over to our Webinar Library & become a Mountains® software expert in no time! Check it out: www.digitalsurf.com/learning/webinars/