Welcome back to Print and Packaging Innovation Asia. This month’s issue is a great read for everyone. We kick of with an article from CGS ORIS, then we look at the Toppan Security Systems new installation in Singapore, then from UPM about “Digitalisation opens up opportunities for collaborative innovation between papermaking & printing technology.”
Next the Print and Media Association of Singapore announces the “International Print Congress”, to be held in Singapore Nov 9-10, booking will open soon but put the date in your note book. Read more about this on pages 31-32. From Japan Sohokkai Corporation about Prinect Production Manager, next BOBST to showcase digital and flexo solutions at Labelexpo 2023 and the last article about Three perspectives on flexo printed packaging innovation. Also loads more articles to keep you busy reading for a while.
Also, the Asian Printing and Packaging Market Place. Here you can now sell and buy equipment online, look to hire staff or make industry announcements. ENJOY!
