Welcome to this month’s Labels and Packaging Innovation Asia. Read all about the latest trends, products and technologies affecting the growing packaging industry. A great EFI article on page 32 titled “Packaging applications are a thriving and growing segment of the industry”, also from Memjet “Planning for Profitability in Labels and Packaging 2021” on page 4, a great read.
Then articles from HP, DIC, XYSX, Gallus, Bobst, Miraclon, and an interview with Atze Bosma, CEO of MPS Systems on page 12. These and much more in this month’s LPIA magazine. Also look out for the BIG announcement of the winners in the 2020 Asian Packaging Excellence Awards, slightly delayed due to the ever-changing Covid restrictions, but will be announced in the next few weeks
