Copper Heat Sink Market size was valued at US$ 623 million in 2024 and is projected to reach US$ 934 million by 2032, at a CAGR of 5.2% during the forecast period 2025-2032
Report Studies
• The global Tungsten Copper Heat Sink Market size was valued at US$ 623 million in 2024 and is projected to reach US$ 934 million by 2032, at a CAGR of 5.2% during the forecast period 2025-2032. The U.S. market accounted for 28% of global revenue in 2024, while China is expected to witness the fastest growth with a projected CAGR of 6.5% through 2032.
• Tungsten Copper Heat Sinks are advanced thermal management solutions that combine the high thermal conductivity of copper with the low thermal expansion of tungsten. These composite materials are specifically engineered for applications requiring efficient heat dissipation under extreme conditions, including high-power electronics, aerospace systems, and military equipment. The product range includes W90Cu10, W80Cu20, W70Cu30, W60Cu40, and W50Cu50 variants, each offering distinct thermal and mechanical properties.
By Type:
• The market is segmented based on type into:
• W90Cu10 Heat Sink
• W80Cu20 Heat Sink
• W70Cu30 Heat Sink
• W60Cu40 Heat Sink
• W50Cu50 Heat Sink
• Others
By Application:
• The market is segmented based on application into:
• Optoelectronics Package
• Microwave Package
• C Package
• Laser Submount
• Others
• ChinaTungsten (China)
• Torrey Hills Technologies, LLC (U.S.)
• Zhuzhou Jiabang Refractory Metal Co., Ltd. (China)
• Edgetech Industries (ETI) (U.S.)
• AMETEK (U.S.)
• Changsha Mingguan Metal Technology Co., Ltd. (China)
• Malico Inc. (U.S.)
• JINXING Company (China)
• Zhuzhou Newmetal Materials Co. (China)
