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Thick film technology involves screen-printing a resistive paste onto a ceramic base and then firing it at high temperatures. This process yields a robust resistor with relatively high power-handling capabilities. Through-hole configurations offer better resistance to environmental stress and mechanical fatigue compared to surface-mount equivalents.
The global Thick Film Through Hole Resistors market was valued at USD 131 million in 2024 and is projected to reach USD 278 million by 2032, reflecting a CAGR of 11.6% over the forecast period. CAGR of 11.6%
(2024 – 2032)
Consumer Electronics
Telecommunications
Automotive and Energy
Industrial and Medical
• Below 1%
• From 1% to 5%
• Above 5%
• Ohmite
• Caddock
• Bourns
• TE Connectivity
• Vishay
• KOA Speer
• Murata