Spring Probe Socket Market size was valued at US$
234 million in 2024 and is projected to reach US$ 345 million by 2032, at a CAGR of 4.9% during the forecast period 2025-2032.
Report Studies
• The global Spring Probe Socket Market size was valued at US$ 234 million in 2024 and is projected to reach US$ 345 million by 2032, at a CAGR of 4.9% during the forecast period 2025-2032. The U.S. market was estimated at USD 68.7 million in 2024, while China is expected to account for USD 92.3 million by 2032, driven by increasing semiconductor manufacturing activities.
• Spring Probe Sockets are critical components used for testing integrated circuits (ICs) and semiconductor devices. These precision-engineered sockets utilize spring-loaded contact probes to establish temporary electrical connections between the device under test (DUT) and test equipment. Key variants include alloy-based and plastic-bodied sockets, each offering distinct advantages in conductivity, durability, and thermal resistance for applications like wafer-level testing.
By Type:
• The market is segmented based on type into:
• Alloy
• Subtypes: Beryllium copper, Phosphor bronze, and others
• Plastic
• Subtypes: High-temperature thermoplastics and others
By Application:
• The market is segmented based on application into:
• Wafer Single Pin Test
• Wafer Double Pin Test
• Smiths Interconnect (U.K.)
• Exatron (U.S.)
• TTS Group (Germany)
• Seiken Co (Japan)
• Yamaichi Electronics (Japan)
• MAC8 (U.S.)
• Yokowo (Japan)
• Aries Electronics (U.S.)
• MICRONICS (Japan)
