Solder Ball Mounting Equipment for Semiconductor
Packaging Market size was valued at US$ 89.4 million in 2024 and is projected to reach US$ 149.3 million by 2032, at a CAGR of 6.7% during the forecast period 2025-2032
Report Studies
• The global Solder Ball Mounting Equipment for Semiconductor Packaging Market size was valued at US$ 89.4 million in 2024 and is projected to reach US$ 149.3 million by 2032, at a CAGR of 6.7% during the forecast period 2025-2032. While the semiconductor industry faced slower growth in 2022 with a 4.4% increase to USD 580 billion (down from 26.2% growth in 2021), the packaging equipment segment remains resilient due to increasing demand for advanced packaging solutions.
• Solder ball mounting equipment plays a critical role in semiconductor packaging processes, particularly for ball grid array (BGA), chip-scale packaging (CSP), and flip-chip technologies. These precision machines deposit microscopic solder balls (typically 50-500 microns in diameter) onto semiconductor packages, enabling electrical connections between the chip and substrate. The equipment includes full-automatic, semi-automatic, and manual variants, with automation levels impacting throughput and placement accuracy (often achieving ±10 micron precision).
By Type:
• The market is segmented based on type into:
• Full-automatic
• Subtypes: High-speed, Ultra-precision, and Multi-functional
• Semi-automatic
• Manual
By Application:
• The market is segmented based on application into:
• BGA (Ball Grid Array)
• CSP and WLCSP (Chip Scale Package/Wafer Level CSP)
• Flip-Chip
• Seiko Epson Corporation (Japan)
• Ueno Seiki Co. (Japan)
• Hitachi High-Tech (Japan)
• ASM Assembly Systems GmbH (Germany)
• SHIBUYA Corporation (Japan)
• Aurigin Technology (Singapore)
• Athlete Corporation (Japan)
