Report Overview:
Semiconductor wafer mounting systems are specialized equipment crucial for semiconductor fabrication processes. These systems handle the precise mounting of wafers onto frames using tapes or films after grinding operations, a critical step that prevents contamination and ensures structural integrity during subsequent processing. The equipment includes fully automatic, semi-automatic, and manual wafer mounting machines, each designed for different production scales and precision requirements.
The market growth is primarily driven by expanding semiconductor manufacturing capacities worldwide, particularly for advanced logic and memory chips. With WSTS forecasting 16% growth in global semiconductor revenues for 2024, reaching USD 611 billion, wafer processing equipment demand is increasing correspondingly. Furthermore, the shift toward larger 12-inch wafer sizes and the industry's emphasis on yield optimization are creating additional demand for high-precision mounting solutions. Leading manufacturers like Nitto Denko and DISCO Corporation continue to innovate in this space, developing systems with improved throughput and contamination control for next-generation semiconductor fabrication.
Market Value:
Global Semiconductor Wafer Mounting Systems market was valued at USD 114 million in 2024 and is projected to grow from USD 122 million in 2025 to USD 185 million by 2032, exhibiting a CAGR of 7.3% during the forecast period.
