• Post CMP Residue Removal Market size was valued at US$ 847.6 million in 2024 and is projected to reach US$ 1.39 billion by 2032, at a CAGR of 7.23% during the forecast period 2025-2032
Report Studies
• The global Post CMP Residue Removal Market size was valued at US$ 847.6 million in 2024 and is projected to reach US$ 1.39 billion by 2032, at a CAGR of 7.23% during the forecast period 2025-2032. The market growth is driven by increasing semiconductor manufacturing activities and shrinking chip geometries requiring advanced cleaning solutions.
• Post CMP (Chemical Mechanical Planarization) residue removal involves specialized chemical formulations designed to eliminate contaminants and byproducts left after the polishing process in semiconductor fabrication. These cleaning solutions target two primary residue types: metal impurities (such as copper, tungsten, or aluminum) and organic residues from polishing slurries. The chemistry typically involves either acidic or alkaline formulations, each optimized for specific material systems and process requirements.
By Type:
• Acidic Material
• Subtypes: Hydrofluoric acid-based, Citric acid-based, Oxalic acid-based
• Alkaline Material
• Subtypes: Ammonium hydroxide-based, TMAH-based formulations
• Chelating Agents
• Surfactant-based Solutions
• Others
By Process Stage:
• Post-Metal CMP Cleaning
• Post-Dielectric CMP Cleaning
• Hybrid Material Cleaning
• Final Wafer Cleaning
Key Players :
Email:
• Entegris (U.S.)
• Versum Materials (Merck KGaA) (Germany)
• Mitsubishi Chemical Corporation (Japan)
• Fujifilm (Japan)
• DuPont (U.S.)
• Kanto Chemical Company, Inc. (Japan)
• BASF SE (Germany)
• Solexir (U.S.)
• Technic (U.S.)
