GNSS Chips and Modules Market size was valued at US$ 3.92 billion in 2024 and is projected to reach US$ 7.43 billion by 2032, at a CAGR of 8.29% during the forecast period 2025-2032
Report Studies
• The global GNSS Chips and Modules Market size was valued at US$ 3.92 billion in 2024 and is projected to reach US$ 7.43 billion by 2032, at a CAGR of 8.29% during the forecast period 2025-2032.
• GNSS chips and modules are critical components that enable devices to receive and process signals from global navigation satellite systems like GPS, GLONASS, Galileo, and BeiDou. These semiconductor solutions provide precise positioning, navigation, and timing (PNT) capabilities across various applications, from smartphones to automotive systems. The technology ranges from standard precision modules offering meter-level accuracy to high-precision chips capable of centimeter-level positioning.
By Types
• High-Precision GNSS Chips and Modules
• Subtypes: RTK (Real-Time Kinematic), PPP (Precise Point Positioning), and others
• Standard-Precision GNSS Chips and Modules
• Subtypes: Standalone GNSS, Assisted GNSS (AGNSS), and others
In-Vehicle Systems
Others
By Technology:
Key Players :
• Qualcomm Technologies (U.S.)
• Broadcom Inc. (U.S.)
• MediaTek Inc. (Taiwan)
• u-blox Holding AG (Switzerland)
• STMicroelectronics (Switzerland)
• Intel Corporation (U.S.)
• Furuno Electric Co., Ltd. (Japan)
• Hexagon AB (Sweden)
• NovAtel Inc. (Canada)
• Septentrio NV (Belgium)
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