CAGR Value:
Dual or Quad Flat Pack No Lead Package Market was valued at US$ 1.38 billion in 2024 and is projected to reach US$ 2.09 billion by 2032, at a CAGR of 5.39% during the forecast period 2025-2032
Report Studies
• The global Dual or Quad Flat Pack No Lead Package Market was valued at US$ 1.38 billion in 2024 and is projected to reach US$ 2.09 billion by 2032, at a CAGR of 5.39% during the forecast period 2025-2032.
• DFN/QFN packages are surface-mount technology (SMT) semiconductor packages that provide superior thermal and electrical performance in compact form factors. These leadless packages feature exposed thermal pads for efficient heat dissipation and shorter electrical paths compared to traditional leaded packages. The market segmentation includes package sizes ranging from 3x3mm to 12x12mm, catering to diverse applications such as mobile communications, automotive electronics, and IoT devices.
By Type:
• The market is segmented based on type into:
• 3×3 to 5×5
• >5×5 to 7×7
• >7×7 to 9×9
• >9×9 to 12×12
Key Players:
• ASE Group (SPIL) (Taiwan)
• Amkor Technology (U.S.)
• JCET Group (China)
• Powertech Technology Inc. (Taiwan)
• Tongfu Microelectronics (China)
• Tianshui Huatian Technology (China)
