• Bluetooth Audio IC Market size was valued at US$ 1.67 billion in 2024 and is projected to reach US$ 3.74 billion by 2032, at a CAGR of 9.6% during the forecast period 2025-2032
Report Studies
• The global Bluetooth Audio IC Market size was valued at US$ 1.67 billion in 2024 and is projected to reach US$ 3.74 billion by 2032, at a CAGR of 9.6% during the forecast period 2025-2032.
• Bluetooth Audio ICs are integrated circuits designed specifically for wireless audio applications using Bluetooth technology. These chips enable high-quality audio streaming, noise cancellation, and lowlatency connectivity in devices like headphones, speakers, and automotive audio systems. Key product categories include ordinary Bluetooth audio chips for basic functionality and Audio SoCs (System-on-Chip) that integrate additional features like DSP processing and power management.
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By Type:
• Ordinary Bluetooth Audio Chip
• Subtypes: Basic audio processing, limited codec support
• Audio SoC (System on Chip)
• Subtypes: AI-enhanced processing, multi-core architectures, advanced codec support
• Others
By Application:
• Portable Audio
• Subtypes: TWS earphones, wireless headphones, neckbands
• Computer Audio
• Home Audio
• Subtypes: Soundbars, wireless speakers, multi-room systems
• Automotive Audio
• Others
Email:
By Automation Level: • Bluetooth 4.2 and Below • Bluetooth 5.0-5.2 • Bluetooth LE Audio • Others
• Standard Power ICs
• Low Power ICs
• Ultra-Low Power ICs
Key Players :
• Cirrus Logic (U.S.)
• Qualcomm Technologies (U.S.)
• Yamaha Corporation (Japan)
• Texas Instruments (U.S.)
• Analog Devices (U.S.)
• ON Semiconductor (U.S.)
• NXP Semiconductors (Netherlands)
• Dialog Semiconductor (U.K.)
• ESS Technology (U.S.)
• ROHM Semiconductor (Japan)
• Bestechnic (China)
• Synaptics (U.S.)
