Wafer Used Dry Etching Equipment Market size was valued at US$ 9.67 billion in 2024 and is projected to reach US$ 18.42 billion by 2032, at a CAGR of 9.7% during the forecast period 2025-2032
Report Studies
• The global Wafer Used Dry Etching Equipment Market size was valued at US$ 9.67 billion in 2024 and is projected to reach US$ 18.42 billion by 2032, at a CAGR of 9.7% during the forecast period 2025-2032.
• Dry etching equipment is a critical semiconductor manufacturing tool that uses plasma to selectively remove material from wafers with high precision. The process involves three main types: silicon etch (for silicon substrates), dielectric etch (for insulating layers), and conductor etch (for metal interconnects). Key components include RF power sources, vacuum chambers, and advanced gas delivery systems that enable nanometer-scale patterning.
By Application:
IDM (Integrated Device Manufacturers)
Foundry
Memory
Logic & MPU
Others
By Technology:
• Reactive Ion Etching (RIE)
• Deep Reactive Ion Etching (DRIE)
• Inductively Coupled Plasma (ICP) Etching
• Cryogenic Etching
• Others
200mm
300mm
450mm
Others
Key Players :
• Lam Research Corporation (U.S.)
• Tokyo Electron Limited (Japan)
• Applied Materials, Inc. (U.S.)
• Hitachi High-Tech Corporation (Japan)
• SEMES Co., Ltd. (South Korea)
• AMEC (China)
Email:
• NAURA Technology Group Co., Ltd. (China)
• SPTS Technologies (KLA Corporation) (U.K.)
• Oxford Instruments (U.K.)
• ULVAC, Inc. (Japan)
• Plasma-Therm LLC (U.S.)
