Copper Clad Laminate Market was valued at 1455 million in 2024 and is projected to reach US$ 1759 million by 2032, at a CAGR of 2.8% during the forecast period
Report Studies
• The global FR4 Copper Clad Laminate Market was valued at 1455 million in 2024 and is projected to reach US$ 1759 million by 2032, at a CAGR of 2.8% during the forecast period. The market continues to expand steadily, driven by growing demand across various industries, though at a moderate pace compared to highgrowth electronics segments.
• FR4 copper clad laminate (CCL) refers to glass fiber-reinforced epoxy resin composite materials laminated with copper foil on one or both sides. As the most widely used substrate material in printed circuit boards (PCBs), FR4 offers excellent mechanical strength, thermal stability, and electrical insulation properties. These characteristics make it indispensable for applications ranging from consumer electronics to military equipment.
By Type:
• The market is segmented based on type into:
• Low-end Sheet
• Used primarily in cost-sensitive applications with basic performance requirements
• Mid-end Sheet
• Balances performance and cost for mainstream applications
• High-end Sheet
• Features superior thermal stability and electrical properties for demanding applications
By Application:
• The market is segmented based on application into:
• Military Industry
• Used in defense electronics requiring high reliability
• Consumer Electronics
• Applications in smartphones, tablets and home appliances
• Communication Network Equipment
• 5G infrastructure and telecom devices driving demand
• Digital Circuits
• Printed circuit boards for computing and industrial applications
• Others
• Including medical equipment and automotive electronics
• ROGERS Corporation (U.S.)
• Mitsubishi Gas Chemical (Japan)
• Panasonic Corporation (Japan)
• Hitachi Chemical (Japan)
• Isola Group (U.S.)
• ITEQ Corporation (Taiwan)
• Nanya New Material Technology (Taiwan)
• Doosan Electronic (South Korea)
