Contact Wafer Temperature Measurement System
Market size was valued at US$ 89 million in 2024 and is projected to reach US$ 154 million by 2032, at a CAGR of 8.2% during the forecast period 2025-2032
Report Studies
• The global Contact Wafer Temperature Measurement System Market size was valued at US$ 89 million in 2024 and is projected to reach US$ 154 million by 2032, at a CAGR of 8.2% during the forecast period 2025-2032.
• Contact Wafer Temperature Measurement Systems are precision instruments designed for in-situ monitoring of semiconductor wafer temperatures during fabrication processes. These systems play a critical role in ensuring thermal uniformity and process control in applications such as etching, deposition, and annealing. The technology encompasses both wired and wireless measurement solutions with various sensor types including thermocouples and resistive temperature detectors (RTDs).
By Type:
• The market is segmented based on type into:
• Wired
• Subtypes: Thermocouple-based, RTDbased, and others
• Wireless
• Subtypes: Infrared-based, RF-based, and others
• The market is segmented based on application into:
• Wafer Process Equipment Manufacturer
• IC Manufacturer
• Reticle Manufacturer
• Others
• KLA Corporation (U.S.)
• Phase IV Engineering Inc. (U.S.)
• Thermo Electric (Germany)
• SPM (South Korea)
• ERS electronic GmbH (Germany)
• Advanced Energy Industries, Inc. (U.S.)
