Pad Market size was valued at US$ 234 million in 2024 and is projected to reach US$ 389 million by 2032, at a CAGR of 7.5% during the forecast period 2025-2032
Report Studies
• The global CMP Soft Pad Market size was valued at US$ 234 million in 2024 and is projected to reach US$ 389 million by 2032, at a CAGR of 7.5% during the forecast period 2025-2032.
• CMP Soft Pads are specialized consumables used in the semiconductor manufacturing process for chemical mechanical planarization (CMP). These precision-engineered pads play a critical role in achieving nanometer-level surface uniformity on silicon wafers by removing excess material through a combination of chemical and mechanical action. The pads are categorized into soft pads and adjustable pads, with soft pads dominating the market due to their superior performance in advanced node semiconductor fabrication. Email: help@semiconductorinsight.com
By Type:
• The market is segmented based on type into:
• Soft Pad
• Subtypes: Polyurethane-based, Fiber-based, and others
• Adjustable Pad
• Subtypes: Pressure-adjustable, Fixed-pressure, and others
• Composite Pad
• Grooved Pad
• Others
By Application:
• The market is segmented based on application into:
• 300mm Wafer
• 200mm Wafer
• Other Wafer Sizes
• DuPont de Nemours, Inc. (U.S.)
• CMC Materials, Inc. (U.S.) – now Entegris subsidiary
• FUJIBO Holdings (Japan)
• IVT Technologies Co., Ltd. (Taiwan)
• TWI Incorporated (Japan)
• 3M Company (U.S.)
• Dow Chemical Company (U.S.)
