CMP Slurry for GaN Wafer (GaN Substrate) Market, Global Outlook and Forecast 2025-2032

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Report Overview:

 CMP slurries for GaN wafers are specialized chemical-mechanical polishing solutions designed to achieve ultra-smooth surfaces on gallium nitride substrates. These formulations typically contain abrasive particles (such as colloidal silica or alumina) suspended in chemical solutions that simultaneously polish and chemically modify the wafer surface. The process is critical for reducing surface defects and improving epitaxial layer quality in GaN-based semiconductor devices.

 The market expansion is driven by several key factors including the growing demand for high-performance power electronics in electric vehicles and 5G infrastructure. While the RF GaN segment currently dominates with over 85% market share in GaN devices (valued at USD 1.9 billion in 2023), power GaN applications are expected to drive future slurry demand. Leading products like Saint-Gobain's GaiN 200 and Fujimi's COMPOL EX-3 demonstrate the technological advancements in slurry formulations that enable superior planarization of these hard semiconductor materials.

Market Value:

 Global CMP Slurry for GaN Wafer (GaN Substrate) market was valued at USD 6.8 million in 2024. The market is projected to grow from USD 8.2 million in 2025 to USD 32.7 million by 2032, exhibiting a CAGR of 24.1% during the forecast period.  CAGR of 24.1%

(2024 – 2032)

By Applications:

 4-inch GaN Wafer

 2-inch GaN Wafer

 6-inch GaN Wafer (Emerging segment)

 Custom/Specialty Wafers

By Types:

• Colloidal Silica Polishing Slurry

• Alumina Polishing Slurry

• Ceria-based Slurry

• Hybrid Slurries

Key players include:

• Saint-Gobain (France)

• Fujifilm Holdings (Japan)

• Fujimi Corporation (Japan)

• Anjimirco Shanghai (China)

• Entegris (United States)

• CMC Materials (United States)

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