Published On : 24 Oct 2025
• Cellular IoT Module Chipset Market size was valued at US$ 4,670 million in 2024 and is projected to reach US$ 9,780 million by 2032, at a CAGR of 11.12% during the forecast period 2025-2032
Report Studies
• The global Cellular IoT Module Chipset Market size was valued at US$ 4,670 million in 2024 and is projected to reach US$ 9,780 million by 2032, at a CAGR of 11.12% during the forecast period 2025-2032. The semiconductor industry backdrop shows robust growth, with global semiconductor revenues reaching USD 579 billion in 2022 and expected to expand to USD 790 billion by 2029 at 6% CAGR.
• Cellular IoT Module Chipsets are specialized semiconductor components that enable wireless communication for IoT devices across cellular networks (4G LTE, 5G, NB-IoT). These chipsets integrate baseband processing, RF transceivers, power management, and security features into compact modules, facilitating machine-to-machine (M2M) connectivity in applications ranging from smart meters to industrial automation.
Key Players :
• Qualcomm Technologies Inc. (U.S.)
• MediaTek Inc. (Taiwan)
• UNISOC (China)
• Hisilicon (China)
• ASR Microelectronics (China)
• Intel Corporation (U.S.)
• Eigencomm (U.S.)
• Sequans Communications (France)
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