300 mm Through Glass Via Wafer Market was valued at 83.6 million in 2024 and is projected to reach US$ 431 million by 2032, at a CAGR of 27.1% during the forecast period.
Report Studies
• The global 300 mm Through Glass Via Wafer Market was valued at 83.6 million in 2024 and is projected to reach US$ 431 million by 2032, at a CAGR of 27.1% during the forecast period.
• A 300 mm Through Glass Via (TGV) wafer refers to an advanced semiconductor substrate incorporating vertical interconnects (vias) through glass. These wafers enable high-density 3D packaging solutions by facilitating electrical connections between front and back surfaces. The technology is increasingly adopted in RF devices, MEMS sensors, and high-performance computing applications due to its superior signal integrity and thermal performance compared to traditional silicon interposers.
By Type:
• The market is segmented based on type into:
• Chemical Etching Technology
• Subtypes: Wet etching, Dry etching, and others
• Laser Drilling Technology
By Application:
• The market is segmented based on application into:
• Consumer Electronics
• Subtypes: Smartphones, Wearables, and others
• Automobile Electronics
• Industrial Electronics
• Others
• Corning Incorporated (U.S.)
• LPKF Laser & Electronics AG (Germany)
• Samtec Inc. (U.S.)
• KISO WAVE Co., Ltd. (Japan)
• Xiamen Sky Semiconductor (China)
• Tecnisco (Japan)
• Plan Optik AG (Germany)
