2.5G DFB Laser Chip Market size was valued at US$
189 million in 2024 and is projected to reach US$ 234 million by 2032, at a CAGR of 2.7% during the forecast period 2025-2032
Report Studies
• The global 2.5G DFB Laser Chip Market size was valued at US$ 189 million in 2024 and is projected to reach US$ 234 million by 2032, at a CAGR of 2.7% during the forecast period 2025-2032. This growth is aligned with the broader semiconductor market expansion, which was estimated at USD 579 billion in 2022 and is expected to reach USD 790 billion by 2029 at a 6% CAGR.
• 2.5G DFB (Distributed Feedback) Laser Chips are semiconductor devices that generate precise, single-wavelength laser beams through an integrated diffraction grating. These components are critical for optical communication systems, particularly in fiber optic networks, enabling stable and efficient data transmission. The chips operate across key wavelengths including 1310nm, 1490nm, 1270nm, and 1550nm, each optimized for specific applications.
By Type:
• The market is segmented based on type into:
• 1310nm DFB Laser Chip
• 1490nm DFB Laser Chip
• 1270nm DFB Laser Chip
• 1550nm DFB Laser Chip
By Application:
• The market is segmented based on application into:
• GPON
• XG-PON
• 40/80km Fiber Access
• GLSUN Science & Technology (China)
• Wuhan Aroptics-tech (China)
• Henan Shijia Photons Technology (China)
• Yuanjie Semiconductor Technology (China)
• CETC13 (China Electronics Technology Group)
• Optocom Corporation (Taiwan)
• Wuhan Eliteoptronics (China)
• Suzhou EverBright Photonics (China)
